Metallic Cover Venting Holes Prevent Glue Overflow
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Solution Overview
Problem
In miniaturization chip modules, the reduction of soldering area for metallic covers compromises mechanical strength, leading to deformation and disassembly issues, particularly affecting SMD chip units with weaker mechanical strength.
Innovation Solution
A metallic cover design featuring a sizing hole and multiple venting holes positioned above SMD chip units, with glue filling the slits between the cover and chip units, providing structural support and preventing glue overflow, while minimizing the welded area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the soldering area of the metallic cover is reduced to achieve miniaturization, then the size of the chip module is reduced, but the mechanical strength of the metallic cover deteriorates causing deformation
Solution Approach 1:
The metallic cover is segmented into multiple functional zones: a first region with reduced soldering area for miniaturization, a second region with normal soldering area for mechanical strength, and a third region for EMI shielding. This segmentation allows each zone to serve its specific function without compromising overall performance.
Solution Approach 2:
Different regions of the metallic cover are designed with different qualities: the first region has minimal soldering for size reduction, the second region has adequate soldering for structural support, and the third region provides electromagnetic shielding. This local differentiation resolves the contradiction between miniaturization and mechanical strength.
2Volume of moving object
If the soldering area of the metallic cover is reduced, then miniaturization is achieved, but the metallic cover becomes prone to delamination during disassembly
Solution Approach 1:
The bonding structure is segmented into soldered regions for permanent attachment and glue-filled regions for reversible bonding. The glue-filled slits in the second region provide reliable bonding that can be cleanly separated, preventing delamination issues during disassembly.
Solution Approach 2:
Glue is introduced as an intermediary bonding material in the slits between the metallic cover and substrate. This glue provides strong bonding during operation but allows clean separation during disassembly, unlike traditional soldering which causes delamination problems.
3Object-affected harmful factors
If the metallic cover embraces SMD chip units with weaker mechanical strength, then EMI shielding is improved, but the chip units are damaged due to cover deformation
Solution Approach 1:
The metallic cover is divided into regions with different mechanical properties. The second region with normal soldering area provides structural support to prevent deformation, while the first region with reduced soldering provides EMI shielding. This segmentation protects weak SMD chips from deformation damage.
Solution Approach 2:
The metallic cover exhibits local quality differences: areas above strong chip units have reduced soldering for miniaturization, while areas above weak SMD chip units have normal soldering for mechanical support. This local adaptation protects vulnerable components while achieving overall miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances mechanical strength, prevents deformation, facilitates easier disassembly, and improves heat dissipation, thereby protecting SMD chip units and enabling miniaturization for increased product competitiveness.
Implementation Method 1
the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the metallic chip unit
Implementation Method 2
the metallic cover covers the SMD and is soldered onto the substrate as a shield for the chip unit to prevent any EMI effect and promote heat dissipation
Implementation Method 3
the metallic cover covers the SMD and is soldered onto the substrate
Data Source
AI summary
A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.