Metallic Frame Unit for Driver IC Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices face challenges in effectively dissipating heat from driver ICs, particularly when they are surrounded by resin materials and closely packed, leading to inadequate heat dissipation and potential malfunctions.
Innovation Solution
The proposed solution involves a display device configuration with a metallic frame unit opposite to the driver IC, allowing for heat conduction and dissipation through a metallic frame unit, which can be in direct contact or separated by an elastic member, and a third metallic frame covering the outer periphery, enhancing heat dissipation by creating gaps and using resin spacers for positioning and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation holes are made in resin cell guide and metallic rear frame, then heat dissipation path is provided, but sufficient heat dissipation effect is hardly obtained because driver IC is surrounded by resin cell guide and surroundings are easily filled with heat
Solution Approach 1:
A metallic frame unit is introduced as an intermediary heat dissipation component positioned between the driver IC and the rear frame. This metallic frame unit directly contacts the driver IC and provides an efficient thermal conduction path to the rear frame, overcoming the insufficient heat dissipation through resin material alone.
Solution Approach 2:
The heat dissipation structure combines resin cell guide with a metallic frame unit and metallic rear frame. This composite structure leverages the thermal conductivity of metals while maintaining the structural and insulating properties of resin, creating an effective hybrid heat dissipation system.
2Illumination intensity
If driver ICs are disposed close to each other in overlapping display panels, then high contrast is achieved, but driver ICs particularly on backlight side easily become high-temperature state and heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation function is segmented from the generic frame structure by introducing a dedicated metallic frame unit specifically positioned opposite the driver IC. This segmented approach provides targeted heat dissipation for the driver IC region without affecting other parts of the display device structure.
Solution Approach 2:
The metallic frame unit is specifically positioned and dimensioned to provide localized heat dissipation exactly where needed - opposite the driver IC on the backlight side. This local quality enhancement addresses the specific thermal problem in the driver IC region while maintaining the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation properties of driver ICs, preventing temperature-related malfunctions by effectively transferring and dissipating heat away from the ICs, even in densely packed display panel setups.
Implementation Method 1
heat generated in the driver IC may be transferred to the metallic frame unit by heat conduction in solids
Data Source
AI summary
A display device includes: a display panel; a driver IC that outputs a driving signal to the display panel; a flexible substrate on which the driver IC is mounted; a first frame that supports the display panel from a side of a light source; and a second frame that supports the light source while being provided independently of the first frame. The first frame includes a metallic frame unit which is opposite to the driver IC from the side of the light source.