Metallic Heat-Dissipation Substrate for Power Module Thermal Management
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Solution Overview
Problem
Conventional on-board high-power DC-DC power modules face inefficiencies in heat dissipation due to high-power density, with heat-generating components on both sides of the printed circuit board experiencing poor heat conduction through gaps to the system board, leading to reduced heat-dissipation efficiency.
Innovation Solution
A power module with a first metallic heat-dissipation substrate is introduced, where the substrate's fixing position is connected to the printed circuit board, and a gap-filling material is used to fill the gap between the heat-dissipating position and the heat-generating component, enhancing heat conduction and increasing the heat-dissipation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If heat-generating components are placed on both surfaces of the printed circuit board to increase power density, then output power and efficiency are improved, but heat-dissipation efficiency deteriorates due to gaps between components and the system board
Solution Approach 1:
A metallic heat-dissipation substrate is introduced as an intermediary component between the heat-generating components and the system board. This substrate provides a dedicated thermal conduction path that bridges the gap caused by tolerance accumulation, enabling efficient heat transfer from components on both surfaces of the PCB to the system board without relying on direct component-to-board contact
Solution Approach 2:
The heat-dissipation solution transitions from a two-dimensional PCB surface mounting approach to a three-dimensional thermal management structure. The metallic substrate extends vertically beneath the PCB, creating additional thermal conduction pathways in the depth dimension that bypass the gap problems associated with surface-level heat dissipation
2Temperature
If a conventional heatsink is installed on the top portion of the power module, then overall temperature is reduced, but heat-dissipation efficiency remains poor due to gap-induced thermal resistance
Solution Approach 1:
The metallic heat-dissipation substrate serves as a thermal intermediary that couples the heatsink to the heat-generating components through the printed circuit board. This substrate provides continuous thermal pathways through the board thickness, eliminating the thermal breaks caused by gaps and ensuring efficient heat transfer from the components to the heatsink
Solution Approach 2:
The thermal management system employs a composite structure combining the metallic heat-dissipation substrate with the printed circuit board and heatsink. The metallic substrate's superior thermal conductivity complements the electrical insulation properties of the PCB, creating a hybrid thermal management system that addresses both electrical and thermal requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces heat resistance and enhances heat-dissipation efficiency by increasing the heat-conduction path and area, effectively addressing the inefficiencies in conventional modules.
Implementation Method 1
filling the gap between the heat-dissipating position of the first surface of the first metallic heat-dissipation substrate and the heat-generating component with the gap-filling material, the heat resistance is reduced, the heat-dissipation area and the heat conduct path are increased
Implementation Method 2
The first metallic heat-dissipation substrate has a first surface and a second surface opposite to each other, and an opening. The first surface of the first metallic heat-dissipation substrate has at least one fixing position and at least one heat-dissipating position. The fixing position of the first surface of the first metallic heat-dissipation substrate is connected with the second surface of the printed circuit board
Data Source
AI summary
A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.