Metallic Layer Transfer for EMI Shielding and Thermal Dissipation

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Solution Overview

Problem

Conventional semiconductor packages face challenges in effectively shielding electromagnetic interference (EMI) and radiofrequency interference (RFI) due to the limitations of existing shielding solutions, which often require host device-level implementation and can increase package thickness and complexity.

Innovation Solution

A metallic layer transfer assembly is integrated into the encapsulation process of semiconductor devices, where a metallic layer is applied onto a substrate or molding compound to provide EMI/RFI shielding and thermal dissipation, using materials like aluminum or copper, and optionally combined with other metals or compounds for enhanced shielding properties, and embedded within the molding compound during encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional shielding solutions are implemented at the host device level, then EMI/RFI shielding is achieved, but package thickness and device complexity increase

Engineering Contradiction:

ImproveEMI/RFI interferenceVSAvoidpackage thickness

Core Design Contradiction:

Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The patent applies a metallic layer to the molding compound surface before encapsulation, integrating the EMI/RFI shielding function into the packaging process itself rather than adding it later at the host device level. This preliminary action prevents interference while avoiding additional thickness from separate shielding components.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent combines the EMI/RFI shielding function with the existing molding compound structure by applying a metallic layer directly to it. This merging integrates multiple functions (structural support, encapsulation, and electromagnetic shielding) into a single integrated component, eliminating the need for separate shielding elements that would increase package thickness.

Inventive Principle:

Principle #5Merging (Combining)

2Object-affected harmful factors

If conventional shielding solutions are implemented at the host device level, then EMI/RFI shielding is achieved, but manufacturing complexity increases

Engineering Contradiction:

ImproveEMI/RFI interferenceVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the EMI/RFI shielding function with the existing molding compound structure by applying a metallic layer directly to it. This merging integrates multiple functions (structural support, encapsulation, and electromagnetic shielding) into a single integrated component, eliminating the need for separate shielding elements that would increase package thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Inventive Principle:

Principle #10Preliminary action

3Object-affected harmful factors

If a metallic layer is applied during encapsulation, then EMI/RFI shielding is provided, but thermal management requirements increase

Engineering Contradiction:

ImproveEMI/RFI interferenceVSAvoidthermal dissipation

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent employs a metallic layer that simultaneously provides three functions: EMI/RFI shielding through electromagnetic reflection and absorption, thermal management through heat dissipation from the semiconductor device, and structural support as part of the encapsulated assembly. This multi-functionality resolves the contradiction by making the shielding layer contribute positively to thermal management rather than creating additional thermal challenges.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces interference while maintaining package thickness and simplifying the manufacturing process, providing comprehensive EMI/RFI shielding and thermal management without adding bulk to the semiconductor device.

Implementation Method 1

a metallic layer is applied onto a substrate or molding compound to provide EMI/RFI shielding

Methodology Applied

Scientific EffectElectromagnetic radiation shielding: Absorption (EM radiation)

Implementation Method 2

providing comprehensive EMI/RFI shielding and thermal management

Methodology Applied

Scientific EffectElectromagnetic reflection: Reflection

Implementation Method 3

a metallic layer is applied onto a substrate or molding compound to provide EMI/RFI shielding and thermal dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9337153B2EMI shielding and thermal dissipation for semiconductor device

Publication Date: 2016.05.10 SANDISK TECHNOLOGIES LLC

AI summary

A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.