Metallic Reinforcement for Liquid Ejection Communication Opening
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Solution Overview
Problem
The circumferentially facing portion of the laminated body around the communication opening in liquid ejection apparatuses is susceptible to damage due to external forces and pressure from ink flow, as it is not supported by the channeled substrate and is subjected to adhesive shrinkage and vibration from piezoelectric driving.
Innovation Solution
Incorporating a metallic layer around the communication opening to reinforce the circumferentially facing portion, which is electrically connected to the common electrode and extends from the vibration plate to the annular wall portion, providing structural support and preventing damage from ink pressure and vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circumferentially facing portion is made thin to reduce overall device thickness, then the device becomes more compact, but the portion becomes more susceptible to damage from external forces and ink pressure
Solution Approach 1:
The circumferentially facing portion is constructed as a composite structure combining a thin laminated body with an integrated metallic reinforcement layer. The metallic layer (e.g., aluminum, stainless steel) is formed on the circumferential surface to provide high strength and damage resistance, while the thin laminated body maintains compactness. This composite approach allows the device to achieve both reduced thickness and enhanced durability.
Solution Approach 2:
The metallic reinforcement layer is applied locally only to the circumferentially facing portion where damage susceptibility is highest, rather than reinforcing the entire device. This localized reinforcement strategy provides targeted strength enhancement at the critical communication opening area while maintaining overall device compactness and minimizing additional material usage.
2Ease of manufacture
If adhesive is applied to bond the reservoir formation substrate to the laminated body, then bonding is achieved, but adhesive shrinkage applies additional force to the circumferentially facing portion causing potential damage
Solution Approach 1:
The metallic reinforcement layer is formed on the circumferentially facing portion before the adhesive bonding process. This pre-reinforcement acts as a cushioning structure that absorbs and distributes the shrinkage forces generated during adhesive curing, preventing these forces from damaging the thin laminated body structure.
Solution Approach 2:
The metallic layer bonded to the laminated body creates a composite structure with superior mechanical properties. This composite construction provides both the bonding interface for the reservoir formation substrate and the structural reinforcement needed to withstand adhesive shrinkage forces during the manufacturing process.
3Productivity
If the piezoelectric elements are driven to vibrate for ink ejection, then ink ejection function is achieved, but vibrations are applied to the circumferentially facing portion causing potential damage
Solution Approach 1:
The metallic reinforcement layer integrated with the laminated body creates a composite structure with high vibration resistance. This composite construction dampens and absorbs the vibrations generated during piezoelectric element operation, protecting the thin circumferentially facing portion from vibration-induced damage while maintaining full ink ejection functionality.
4Strength
If the circumferentially facing portion is reinforced with a metallic layer, then damage susceptibility is reduced, but device complexity increases
Solution Approach 1:
The metallic reinforcement layer is integrated directly into the circumferentially facing portion structure, merging the reinforcement function with the existing laminated body rather than adding it as a separate component. This integration approach enhances damage resistance while minimizing increases in device complexity.
Solution Approach 2:
The metallic layer is formed using thin-film deposition techniques that maintain minimal thickness, changing the material parameter rather than adding substantial structural complexity. This allows the circumferentially facing portion to achieve enhanced strength through material property changes rather than complex structural additions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metallic layer effectively reduces the susceptibility of the circumferentially facing portion to damage, maintaining the integrity of the liquid ejection apparatus by distributing external forces and preventing ink leakage, while ensuring reliable ink supply to the pressure chambers.
Implementation Method 1
The metallic layer effectively reduces the susceptibility of the circumferentially facing portion to damage, maintaining the integrity of the liquid ejection apparatus by distributing external forces and preventing ink leakage
Implementation Method 2
The laminated body includes a vibration plate covering the pressure chambers and a plurality of piezoelectric elements corresponding to the pressure chambers
Data Source
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AI summary
A liquid ejection apparatus comprising: a nozzle; a first channeled structure defining a first liquid channel, the first liquid channel communicating with the nozzle; a second liquid channel; a communication opening connecting the first liquid channel and the second liquid channel; a laminated body including a piezoelectric element and a metal layer, the laminated body having a first portion supported by the first channeled structure and a second portion extending over the first liquid channel and not supported by the first channeled structure, the communication opening extending through the second portion of the laminated body such that the second portion surrounds the communication opening; wherein the second portion of the laminated body includes the metal layer surrounding the communication opening.