Split Metallic Seal Structures for Die-to-Die Routing Integrity
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Solution Overview
Problem
Current seal ring designs in integrated circuit manufacturing fail to effectively protect against microcracking, delamination, moisture ingress, and ion diffusion, especially when adjacent to scribed die edges, while also limiting flexibility in die-to-die routing and integration of circuit blocks within smaller form factors.
Innovation Solution
The implementation of split metallic seal structures and sealed box structures that allow for die-to-die routing through or over seal structures, using through silicon vias and electromagnetic field communication to facilitate inter-die or intra-die connections without compromising the integrity of the seal rings, enabling protection against defects and allowing for flexible die harvesting and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If continuous filled trenches and vias are used to form seal rings, then protection against microcracking and delamination is improved, but flexibility in die-to-die routing is worsened
Solution Approach 1:
The seal ring is divided into multiple discrete seal segments rather than a continuous structure. These segments are formed by selectively removing portions of the continuous filled trenches and vias, creating gaps that allow routing flexibility while maintaining protective function in critical areas
Solution Approach 2:
Different portions of the seal structure have different properties - some areas maintain continuous sealing for maximum protection, while other areas are segmented to accommodate routing. The seal segments are strategically positioned to provide protection where needed while allowing interconnect passage where required
2Reliability
If seal rings completely surround circuit areas, then protection against moisture ingress and ion diffusion is improved, but area available for circuit blocks is worsened
Solution Approach 1:
The complete surrounding seal is segmented into discrete sections, reducing the total area occupied by seal structures. The segments are positioned at critical locations where protection is most needed, rather than forming a continuous barrier that consumes excessive area
Solution Approach 2:
The seal structure utilizes vertical dimension through multi-layer metallization with trenches and vias, providing robust protection in the vertical direction while minimizing horizontal area consumption. This allows circuit blocks to expand in the planar dimensions
3Adaptability or versatility
If openings are provided within seal rings for electrical interconnect lines, then die-to-die routing flexibility is improved, but protection against microcracking and moisture ingress is worsened
Solution Approach 1:
The seal structure has non-uniform properties - continuous in some regions for maximum protection, segmented with openings in other regions for routing. The openings are strategically located away from critical circuit areas while maintaining routing flexibility
Solution Approach 2:
The segmented seal structure acts as an intermediary between the conflicting requirements of complete sealing and routing flexibility. The gaps in the seal allow interconnect passage while the continuous portions maintain protective function
Data Source
AI summary
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.