Metallic Tape Cooling Element for Memory Sub-System Heat Dissipation
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Solution Overview
Problem
Conventional memory sub-systems without metallic cases or enclosures face challenges in heat dissipation due to restricted form factors, leading to performance issues as conventional heatsinks or fans cannot be used, causing heat to remain within the system.
Innovation Solution
A thermal cooling element in the form of a metallic tape with bumps or protrusions is used to dissipate heat from memory devices, transferring heat away from the devices while adhering to the restricted form factor and enhancing air movement for improved cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heatsinks or fans are used for cooling memory devices, then heat dissipation performance is improved, but device height and form factor complexity increase
Solution Approach 1:
The patent transitions from vertical heat dissipation (conventional heatsinks extending upward) to horizontal heat dissipation (metallic tape extending laterally from the memory device). This dimensional change allows effective cooling without increasing the height profile, solving the contradiction between heat dissipation performance and device height constraints.
Solution Approach 2:
The patent employs a thin metallic tape as the cooling element, which is flexible and can be positioned in close proximity to the memory device surface. This thin-film approach provides effective heat conduction and dissipation while maintaining a minimal height profile, avoiding the bulkiness of conventional heatsinks.
2Temperature
If metallic case or enclosure is used to provide thermal cooling, then heat dissipation is improved, but device complexity and form factor flexibility are reduced
Solution Approach 1:
The patent extracts the cooling function from the overall device enclosure (metallic case) and implements it as a separate, independent metallic tape element. This allows the memory device to achieve effective thermal cooling without requiring a bulky metallic case or enclosure, thereby maintaining form factor flexibility while improving heat dissipation.
Solution Approach 2:
The metallic tape serves multiple functions: it acts as a heat sink for thermal management, provides structural support, and can be integrated into various form factors without requiring a complete metallic enclosure. This multi-functionality resolves the contradiction by providing cooling benefits without the complexity of a full metallic case.
3Length of moving object
If restricted form factor is maintained, then device portability and integration are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent redirects heat dissipation from the vertical dimension to the horizontal dimension by using a laterally extending metallic tape. This allows the device to maintain a compact height profile while effectively dissipating heat through the extended tape surface area, resolving the contradiction between form factor compactness and heat dissipation capability.
Solution Approach 2:
The patent changes the geometric parameters of the cooling solution by using a thin, laterally extended metallic tape instead of a vertically extended conventional heatsink. This parameter change (from vertical to horizontal extension) enables effective heat dissipation within restricted height constraints, maintaining both compactness and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal cooling element effectively dissipates heat from memory devices, improving the performance of memory sub-systems by addressing the limitations of restricted form factors and the absence of conventional cooling methods.
Implementation Method 1
The metallic tape can transfer heat from the memory devices towards an end of the metallic tape
Implementation Method 2
The metallic tape can include bumps or other such protrusions to contribute to a steady movement of air over the metallic tape to dissipate the heat from the memory devices
Data Source
AI summary
A memory sub-system can include multiple memory devices and a thermal cooling element. The thermal cooling element includes a bottom surface that is coupled to a top surface of each of the memory devices. Furthermore, the thermal cooling element further has a top surface that includes a protrusions that extend above the top surface of the thermal cooling element to dissipate heat that is generated from the memory devices.