Metallic Terminal Plating Thickness for Bent Portion
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Solution Overview
Problem
The existing metallic terminals experience severe oxidation and corrosion at bent portions due to cracking or peeling of the plating layer, which affects their conductive properties, especially when the plating layer exceeds 2 micrometers in thickness.
Innovation Solution
A metallic terminal with a multi-layer plating structure, where the first plating layer at the bent portion has a thickness between 0.3 and 1.75 micrometers, and the rest of the terminal has a thickness between 2 and 10 micrometers, along with a manufacturing method involving electroplating steps to apply Ni or Ni-W layers and Au or Ag layers, ensuring reduced peeling and maintaining electrical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the plating layer thickness is increased to prevent oxidation and corrosion, then the protective function is improved, but cracks and peeling occur at the bent portion
Solution Approach 1:
The patent applies different plating layer thicknesses to different portions of the terminal. The bent portion has a reduced plating thickness (0.3-1.75 μm) compared to other portions (2-10 μm), allowing the bent area to flex without cracking while maintaining adequate protection in non-bent areas.
Solution Approach 2:
The plating layer is segmented into at least two distinct thickness zones: a first plating layer on the bent portion with reduced thickness, and a second plating layer on other portions with greater thickness. This segmentation allows each zone to serve its specific functional requirement.
2Strength
If the plating layer thickness is reduced to prevent cracking at the bent portion, then the flexibility is improved, but the protective function against oxidation and corrosion is weakened
Solution Approach 1:
Different thickness specifications are assigned to different functional zones: the bent portion uses thinner plating (0.3-1.75 μm) for flexibility, while other portions use thicker plating (2-10 μm) for enhanced corrosion protection, optimizing both requirements simultaneously.
Solution Approach 2:
The plating structure is divided into multiple layers with different thicknesses - a first plating layer with reduced thickness on the bent portion and a second plating layer with greater thickness elsewhere, ensuring both flexibility and protection.
3Reliability
If a uniform thick plating layer is applied to the entire terminal, then the corrosion protection is improved, but the manufacturing complexity increases due to multiple electroplating steps
Solution Approach 1:
A shielding fixture is positioned before electroplating to block the plating solution from reaching the bent portion during specific electroplating steps. This preliminary action allows selective thickness control without requiring separate plating processes for different areas, simplifying the overall manufacturing approach.
Solution Approach 2:
A shielding fixture acts as an intermediary tool during the electroplating process, selectively blocking plating solution from the bent portion. This intermediary device enables differential plating thickness control while using a single electroplating process, reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents peeling of the plating layer at the bent portion, reducing oxidation and corrosion, thereby maintaining the electrical stability and conductive properties of the metallic terminal.
Implementation Method 1
the terminal body is electroplated to form a first plating layer on the terminal body
Implementation Method 2
the metallic terminal is plated, using the principle of the Galvanic effect, to prevent the oxidation or corrosion of the metallic terminal
Implementation Method 3
In the pickling step, oxides on the surface of the terminal body are removed
Data Source
AI summary
A metallic terminal includes a terminal body, a first plating layer, a second plating layer, and a third plating layer. The first plating layer is on the terminal body, and the thickness of the first plating layer at the bent portion of the terminal body is 0.3 to 1.75 micrometers, and the thickness of rest portions of the first plating layer is 2 to 10 micrometers. The second plating layer is on the first plating layer and corresponds to the contact portion of the terminal body, and the thickness of the second plating layer is 0.5 to 2 micrometers. The third plating layer is on the first plating layer and corresponds to the soldering portion of the terminal body, and the thickness of the third plating layer is 0.01 to 0.1 micrometers. A manufacturing method of metallic terminal is also provided.


