Metallization Cooling Head for Light Alloy Components

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Solution Overview

Problem

Existing metallization processes for light alloys result in excessive surface heating, leading to a decrease in mechanical properties and inadequate surface hardness improvement, particularly due to high thermal exchange during the application of metal coatings, which is exacerbated by the small thickness of components.

Innovation Solution

A metallization apparatus and method that uses a cooling head to direct a coolant flow on the opposite surface of the component during metal deposition, preventing excessive temperature rise and ensuring even cooling through component rotation, thereby maintaining mechanical properties and achieving suitable surface hardness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metallization is applied to light alloy components, then surface hardness is improved, but excessive surface heating occurs causing mechanical properties to decay

Engineering Contradiction:
Improvesurface hardnessVSAvoidsurface temperature
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent applies preliminary cooling action by directing coolant jets onto the light alloy substrate before metallization deposition begins. This preemptive cooling counteracts the incoming thermal load from the metallization process, preventing excessive temperature rise that would otherwise cause mechanical property decay in the heat-sensitive light alloy substrate.

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent introduces a coolant flow as an intermediary substance between the metallization source and the light alloy substrate. This intermediary carries away excess heat from the substrate surface during deposition, mediating the thermal interaction and allowing the metallization to proceed without causing damaging temperature increases in the underlying light alloy component.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If metallization is applied to light alloy components, then abrasion resistance is improved, but thermal exchange during application causes inadequate surface hardness improvement

Engineering Contradiction:
Improveabrasion resistanceVSAvoidapplication interface temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies preliminary cooling action by directing coolant jets onto the light alloy substrate before metallization deposition begins. This preemptive cooling counteracts the incoming thermal load from the metallization process, preventing excessive temperature rise that would otherwise cause mechanical property decay in the heat-sensitive light alloy substrate.

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent implements continuous cooling throughout the metallization deposition process by maintaining a steady coolant flow onto the substrate. This continuous thermal management ensures that the substrate temperature remains within acceptable limits throughout the entire coating application, enabling consistent surface hardness improvement and abrasion resistance enhancement without thermal degradation.

Inventive Principle:
Principle #20Continuity of useful action

3Weight of moving object

If component thickness is reduced, then weight is decreased, but temperature control during metallization becomes more difficult

Engineering Contradiction:
Improvecomponent weightVSAvoidsubstrate temperature control
Core Design Contradiction:
Weight of moving objectVSTemperature

Solution Approach 1:

The patent applies preliminary cooling action by directing coolant jets onto the light alloy substrate before metallization deposition begins. This preemptive cooling counteracts the incoming thermal load from the metallization process, preventing excessive temperature rise that would otherwise cause mechanical property decay in the heat-sensitive light alloy substrate.

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent applies localized cooling directly at the metallization application zone by directing coolant jets precisely onto the substrate surface where deposition occurs. This localized thermal management approach efficiently controls temperature in the critical deposition region without requiring cooling of the entire component, making it particularly effective for thin-walled components where overall heat capacity is limited.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively controls temperature rise and maintains mechanical properties, resulting in improved surface hardness and fatigue resistance of light alloy components, with laboratory tests showing a significant increase in fatigue cycles to failure and enhanced hardness profiles compared to prior art techniques.

Implementation Method 1

there is provided the step of addressing a coolant flow, by a cooling head, on a second surface, opposite said first surface and not impinged by the metallization flow

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

preventing excessive temperature rise and ensuring even cooling through component rotation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

addressing by said deposition means, a flow of metal material on a first surface of a wall to be coated of the metal component

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 4

ensuring even cooling through component rotation

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP1925688B1Metallization method
Publication Date: 2017.03.01 MARCONI
  • EP1925688B1 patent drawing
  • EP1925688B1 patent drawing
  • EP1925688B1 patent drawing

AI summary

An apparatus (4) for the metallization of metal components (8) and relevant metallization method. The apparatus (4) and the method of the present invention allow coating light alloy metal components having even very small thickness, ensuring high surface hardness and improved resistance to fatigue of the component itself.