Metallized Temporary Bonding Layer for High-Temperature Substrates

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for temporary bonding of substrates using polymers are environmentally polluting and have low temperature resistance, limiting further increases in lateral density of functional units on substrates.

Innovation Solution

A method involving a metallized temporary bonding layer on substrates, which can be melted, evaporated, or sublimated using debonding radiation, allowing for separation without damaging the substrates, and using a carrier substrate with structured elevations and cavities for efficient detachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If polymers are used as temporary bonding adhesive, then bonding is achieved, but temperature resistance is limited and environmental pollution occurs

Engineering Contradiction:

Improvetemperature resistanceVSAvoidenvironmental pollution

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameter from polymer to metal, fundamentally altering the bonding layer's properties to achieve high temperature resistance and eliminate environmental pollution. The metal temporary bonding layer can withstand processing temperatures exceeding 1000°C, unlike polymers which decompose at lower temperatures, while also being free from chemical pollutants.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a disposable metal temporary bonding layer that serves its bonding function during processing and is then completely removed without trace. The metal layer is designed to be sacrificial, eliminating the need for complex removal processes and avoiding residual pollution, aligning with the principle of using disposable elements that fulfill their purpose and are discarded cleanly.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Ease of manufacture

If polymers are used as temporary bonding adhesive, then bonding is achieved, but material waste and cleaning costs increase

Engineering Contradiction:

Improvebonding processVSAvoidmaterial waste

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent replaces the chemical-based polymer bonding mechanism with a physical metal bonding mechanism. The metal layer bonds through physical adhesion and thermal processes, then is removed via physical ablation or mechanical means, eliminating the need for chemical solvents and cleaning agents. This substitution reduces material waste and cleaning costs significantly.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the harmful chemical components from the bonding process by using pure metal as the temporary bonding layer. The metal can be completely extracted or ablated from the substrate without leaving residues, unlike polymers that require chemical solvents for removal and generate waste. This extraction principle eliminates the need for additional cleaning materials and reduces overall material waste.

Inventive Principle:

Principle #2Taking out (Extraction)

3Productivity

If lateral density of functional units is increased, then substrate functionality is improved, but bonding and debonding becomes more difficult

Engineering Contradiction:

Improvelateral density of functional unitsVSAvoidbonding and debonding process

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

The patent segments the bonding function from the substrate structure by using a separate metal temporary bonding layer. This layer can be applied uniformly across substrates with high lateral density of functional units, providing consistent bonding without interfering with the dense functional elements. The segmented approach allows independent optimization of bonding and substrate functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a metal temporary bonding layer as an intermediary between substrates, enabling bonding and debonding operations without directly contacting the functional units on the substrate surfaces. This intermediary layer protects the dense functional elements during handling and processing, maintaining ease of operation even as lateral density increases.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and environmentally friendly bonding and debonding of substrates, allowing for higher processing temperatures and reduced material waste, while maintaining substrate integrity.

Implementation Method 1

focusing debonding radiation, in particular a laser beam, through the carrier substrate onto the metallised temporary bonding layer and thus melting, evaporating and/or sublimating the metallised temporary bonding layer

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

Methodology Applied

Scientific EffectSublimation: Sublimation

Implementation Method 4

focusing debonding radiation, in particular a laser beam, through the carrier substrate onto the metallised temporary bonding layer

Methodology Applied

Scientific EffectLaser: Laser

Data Source

PatentUS12581906B2Method for bonding and debonding substrates

Publication Date: 2026.03.17 THALLNER ERICH

AI summary

The invention relates to a method for the temporary bonding of a product substrate with a carrier substrate and for the debonding of a product substrate from a carrier substrate, corresponding devices and a substrate stack.