Metallized Paste for Glass Substrate Vias
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Solution Overview
Problem
Current semiconductor device packaging schemes fail to efficiently integrate heterogeneous devices like logic, memory, power, and sensors in a single package with improved electrical performance, due to limitations in creating and filling metallized passages in substrates for signal transfer and connectivity.
Innovation Solution
A method involving the creation of through-holes in glass substrates using protective layers and heat treatment, followed by filling these holes with a lead-free metallized paste material that includes metals, glass frit compositions, solvents, and inert additives, which provides improved adhesion, conductivity, and hermeticity, and is processed using thick film technology to ensure durability and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallization methods are used to create passages in glass substrates, then electrical connectivity is achieved, but adhesion strength and hermeticity are insufficient
Solution Approach 1:
The patent uses a composite paste material containing metal particles (for conductivity), glass frit (for bonding to substrate), and organic vehicle (for processing). This composite approach simultaneously achieves adhesion, conductivity, and hermeticity in a single material system, resolving the contradiction between reliability and manufacturing ease.
Solution Approach 2:
The patent controls the chemical composition parameters of the paste (metal particle size distribution, glass frit composition, organic vehicle type) and processing parameters (firing temperature, atmosphere, time) to optimize the balance between adhesion strength and manufacturing simplicity. By adjusting these parameters, the paste forms a reliable metallized connection without requiring complex multi-step processes.
2Reliability
If lead-free metallized paste material is used, then biocompatibility and hermeticity are improved, but processing complexity increases
Solution Approach 1:
The lead-free paste is formulated as a composite material where glass frit particles provide hermetic sealing, metal particles provide conductivity, and organic binders enable processing. This composite structure achieves hermeticity without lead while maintaining processability through careful selection of compatible materials that work synergistically.
Solution Approach 2:
The patent ensures homogeneous distribution of metal particles and glass frit within the organic vehicle matrix. This uniform composition prevents processing defects and ensures consistent hermeticity and conductivity throughout the metallized passage, reducing the need for complex post-processing steps despite the advanced material composition.
3Reliability
If thick film technology is used for filling passages, then adhesion and conductivity are improved, but manufacturing time increases
Solution Approach 1:
The paste is pre-formulated with optimal metal particle size distribution and glass frit composition before application. This preliminary preparation ensures that during the firing process, the material self-organizes to form conductive pathways and strong bonds efficiently, reducing the actual processing time required while maintaining high electrical conductivity and adhesion.
Solution Approach 2:
The patent optimizes the firing temperature and time parameters based on the specific paste composition. By adjusting these parameters, the thick film process achieves full adhesion and conductivity in a single firing step rather than requiring multiple sequential steps, thereby improving productivity without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the integration of heterogeneous devices by providing strong, conductive, and hermetic connections within semiconductor devices, enabling faster, smaller, and more functional electronic applications while adhering to biocompatibility standards.
Implementation Method 1
The paste material comprises a metal, a glass frit composition, a solvent, a resin, and inert additives... processed using thick film technology
Implementation Method 2
heat treating the substrate to repair damage from the passages creation process... heat treating to relieve stresses
Data Source
AI summary
Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.