Metallized Plastic Socket Impedance Control for High-Speed IC Testing
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Solution Overview
Problem
Current test systems for integrated circuit chips face challenges in maintaining signal integrity at high frequencies, particularly above 56 Gbps, due to limitations in contactor design and materials, which result in significant signal loss and inability to handle smaller size integrated circuit packages effectively.
Innovation Solution
The development of an impedance-controlled electrical connector assembly using a metallized plastic composite material with a coaxial structure, featuring multiple cavities and probes, including signal, ground, and power contact probes, to form a coaxial structure that reduces signal loss and improves radio frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If short contactors are used to maintain signal integrity, then signal loss is reduced, but compliance is small and compression force is high, limiting applications in small size integrated circuit packages
Solution Approach 1:
The patent uses a composite structure combining insulating material (socket body) with metal grounding shells plated on the inner surfaces of cavities. This composite design creates a coaxial structure that provides both electrical insulation and controlled impedance, reducing signal loss while accommodating various contactor sizes and types for different IC package applications
2Reliability
If coaxial structure with insulated metal structure is used for contactors, then signal integrity is maintained for large sized integrated circuit packages, but it does not meet new requirements for approximately 56 Gbps and higher frequencies
Solution Approach 1:
The patent modifies the coaxial structure parameters by plating the inner surfaces of cavities with conductive material to form metal grounding shells, and electrically connecting these shells through signal traces on the socket body. This creates a controlled impedance environment that maintains signal integrity at higher frequencies (56 Gbps and above) by reducing signal loss and improving RF performance
3Reliability
If coaxial structure is used for contactors, then performance standards are met for high-frequency testing, but device complexity increases
Solution Approach 1:
The patent merges the grounding function into the socket body structure itself by forming metal grounding shells on the inner surfaces of cavities and electrically connecting them through signal traces. This integration eliminates the need for separate grounding structures in the contactor, simplifying the overall device while maintaining the coaxial performance standards for high-frequency testing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables testing of higher frequency IC chips with reduced signal loss and improved radio frequency performance, accommodating both small and large size integrated circuit packages, and supports frequencies greater than 56 Gbps or 70 GHz with enhanced signal integrity.
Implementation Method 1
The inner surface of each of the first multiple of cavities is plated or coated with a conductive material to form a metal grounding shell
Implementation Method 2
one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity
Data Source
AI summary
Methods, systems, and apparatus for an electrical connector assembly for connecting an integrated circuit chip to a printed circuit board. The electrical connector assembly includes a socket body that is made of an insulating material. The socket body has a top surface, a bottom surface, and a first plurality of cavities including a first cavity and a second cavity. The first cavity and the second cavity each have an inner surface plated with a conductive material to form a metal grounding shell. The electrical connector assembly includes multiple probes including a first probe and a second probe. The first probe is configured to be positioned within the first cavity and the second probe is configured to be positioned within the second cavity. The electrical connector assembly includes one or more signal traces that electrically connect the metal grounding shells of the first cavity and the second cavity.