Metamaterial Base Material for Crack-Resistant Thin Terahertz Patterns
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Solution Overview
Problem
Metamaterials used in the terahertz band face challenges with pattern thickness reduction leading to reduced rigidity and internal stress due to temperature and humidity changes, resulting in potential cracks.
Innovation Solution
A base material for metamaterials with a thermal dimensional change rate of -0.01% or less, containing fluorine-based or liquid crystal polymers, and a pattern thickness of less than 5 μm, combined with a conductive material and split-ring resonators, to enhance crack suppressibility and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the thickness of the pattern is reduced to lower cost, then the cost is reduced, but the rigidity of the pattern is lowered and internal stress is generated due to deformation of the base material caused by temperature and humidity changes, resulting in cracks in the pattern
Solution Approach 1:
The patent changes the physical-chemical parameters of the base material by controlling its thermal dimensional change rate to be -0.01% or less when allowed to stand in an environment of 90°C for 24 hours. This parameter control allows the use of ultra-thin patterns (less than 5 μm) without generating internal stress that would cause cracks, thus reducing cost while maintaining reliability
Solution Approach 2:
The patent employs composite material design by combining a specifically engineered base material with an ultra-thin pattern layer. The base material contains at least one selected from fluorine-based polymers and liquid crystal polymers, creating a composite structure that provides both dimensional stability and electrical functionality at reduced thickness
2Ease of manufacture
If the thickness of the pattern is reduced to less than 5 μm, then the cost is reduced, but the rigidity of the pattern is lowered making it more susceptible to deformation and cracking
Solution Approach 1:
The patent applies the counterweight principle by using the base material's dimensional stability (thermal dimensional change rate of -0.01% or less) to counterbalance the inherent weakness of ultra-thin patterns. The base material acts as a supportive substrate that compensates for the reduced rigidity of the thin pattern layer, preventing deformation and cracking while maintaining the cost benefits of thin design
3Reliability
If the thermal dimensional change rate is reduced to -0.01% or less, then crack suppressibility is improved, but the dielectric loss tangent must be controlled to maintain electrical characteristics
Solution Approach 1:
The patent simultaneously controls multiple parameters: thermal dimensional change rate (-0.01% or less) for crack suppressibility and dielectric loss tangent (0.01 or less) for electrical characteristics. This multi-parameter optimization is achieved through careful selection of polymer materials (fluorine-based or liquid crystal polymers) and control of manufacturing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses crack occurrence and maintains excellent electrical characteristics, ensuring the stability and performance of metamaterials under varying environmental conditions.
Implementation Method 1
a thermal dimensional change rate in a case of being allowed to stand in an environment of 90° C. for 24 hours is-0.01% or less
Implementation Method 2
the above-described pattern included in the metamaterial disclosed in JP2021-114647A functions as a resonator with respect to the electromagnetic waves in a terahertz band
Data Source
AI summary
Provided are a base material for a metamaterial, in which a thermal dimensional change rate in a case of being allowed to stand in an environment of 90° C. for 24 hours is 0.01% or more and less than 10%; a metamaterial and a laminate including the base material for a metamaterial; and a manufacturing method of a metamaterial.


