Metastructure Chuck for Distortion-Free Wafer Measurement
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Solution Overview
Problem
Existing semiconductor substrate processing apparatuses face challenges in accurately measuring physical properties and detecting defects due to electromagnetic wave distortion caused by numerous structures in the chucking system, which affects the precision of measurements.
Innovation Solution
A semiconductor substrate processing apparatus featuring a metastructure layer with microstructures and a light-transmitting dielectric substrate, where the microstructures and grooves are designed with dimensions smaller than the wavelength of the electromagnetic wave, minimizing distortion by acting as a metastructure that maintains the wave's integrity and providing uniform suction force across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic waves are irradiated from the lower part of the chuck to measure substrate properties, then measurement capability is enabled, but measurement accuracy deteriorates due to wave distortion caused by chuck structures
Solution Approach 1:
The chuck surface is segmented into multiple independent suction regions, each with its own groove structure. This segmentation allows the electromagnetic waves to pass through the gaps between grooves with minimal distortion while still providing effective suction force distribution across the substrate surface.
Solution Approach 2:
The groove structures act as intermediaries that mediate between the suction force transmission function and the electromagnetic wave transmission function. By carefully designing the groove dimensions to be smaller than the electromagnetic wavelength, the grooves provide suction force while allowing waves to pass through with minimal distortion.
2Reliability
If multiple structures are disposed in the lower portion of the chuck to provide suction force, then substrate holding capability is improved, but electromagnetic wave transmission quality deteriorates
Solution Approach 1:
The dimensions of the groove structures are changed to be smaller than the wavelength of the electromagnetic waves. This parameter change allows the grooves to maintain their suction function while becoming transparent to the electromagnetic waves, thus improving wave transmission quality without sacrificing substrate holding capability.
Solution Approach 2:
Different regions of the chuck are designed with different groove patterns and densities. The groove structures are optimized locally to provide appropriate suction force in each region while maintaining overall electromagnetic wave transmission quality. The groove width and spacing are specifically controlled to be smaller than the electromagnetic wavelength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances measurement accuracy by preventing electromagnetic wave distortion and ensuring even suction force distribution, thereby improving the detection of substrate defects and patterns without warping the substrate.
Implementation Method 1
a light-transmitting dielectric substrate including a third surface that faces the second surface and supports the plurality of microstructures, and a fourth surface, opposite to the third surface, and the light-transmitting dielectric substrate configured to allow an electromagnetic wave incident through the fourth surface to be transmitted to the third surface
Implementation Method 2
a metastructure layer including a first surface on which a semiconductor substrate is mounted and a second surface, opposite to the first surface, and the metastructure layer divided into a plurality of microstructures by grooves passing through the first surface and the second surface; wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave
Implementation Method 3
a frame surrounding an external side surface of the metastructure layer and an external side surface of the light-transmitting dielectric substrate, and including an exhaust hole disposed in a region corresponding to the external side surface of the light-transmitting dielectric substrate such as to communicate with the grooves, the exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate
Data Source
AI summary
A semiconductor substrate processing apparatus includes: a metastructure layer divided into a plurality of microstructures by grooves, a light-transmitting dielectric substrate that supports the plurality of microstructures and is configured to allow an electromagnetic wave to be transmitted therethrough, and a frame including an exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate, wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave.