Lead Frame Assembly for Oscillator-IC Alignment in Metering Chips
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Solution Overview
Problem
Existing semiconductor devices used in measurement devices, such as electricity meters, face challenges in manufacturing efficiency and versatility due to the need for precise alignment and bonding of oscillators and integrated circuits, which complicates the manufacturing process and reduces efficiency.
Innovation Solution
A semiconductor device configuration featuring an oscillator with external terminals, an integrated circuit with specific electrode pads, and a lead frame with terminals, where bonding wires connect the components directly, allowing for improved alignment and sealing with a molding resin to enhance manufacturing efficiency and versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an oscillator is mounted on an upper face of an integrated circuit with bonding wires and anisotropic conductive adhesive film, then the device can be assembled, but manufacturing efficiency is poor and the process is complex
Solution Approach 1:
The patent combines the oscillator mounting process with the integrated circuit mounting process by using a common lead frame structure. Both components are mounted on the same lead frame and connected through a unified bonding wire configuration, eliminating the need for separate mounting steps and reducing overall process complexity.
Solution Approach 2:
The lead frame is designed to serve multiple functions: it acts as both the mounting substrate for the integrated circuit and the mounting substrate for the oscillator. The same lead frame terminals are used to connect both components, creating a universal mounting structure that simplifies manufacturing.
2Adaptability or versatility
If an oscillator is mounted on an upper face of an integrated circuit, then the device can be assembled, but position matching is required and versatility is reduced
Solution Approach 1:
The patent segments the mounting structure by providing separate mounting regions on the lead frame for the integrated circuit and the oscillator. Each component has its own designated mounting area with corresponding terminals, eliminating the need for precise position matching between the oscillator and integrated circuit while maintaining versatility in component placement.
3Productivity
If bonding wires are used to connect the lead frame and integrated circuit, then electrical connection is achieved, but manufacturing efficiency is poor
Solution Approach 1:
The lead frame is pre-configured with terminals and bonding wire connection points before the integrated circuit and oscillator are mounted. This preliminary preparation allows for faster assembly since the connection infrastructure is already in place, improving manufacturing efficiency without sacrificing ease of connection.
Data Source
AI summary
A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.