Thermally Conductive Methacrylate Adhesive for Battery Bonding
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Solution Overview
Problem
Existing curable (meth)acrylate compositions used in battery bonding applications lack high thermal conductivity and adequate mechanical properties, often acting as thermal insulators rather than efficient heat conductors, and there is a lack of two-component (meth)acrylate compositions addressing this issue.
Innovation Solution
A two-component (meth)acrylate composition comprising at least 70 wt.-% thermally conductive filler, with specific monomers, elastomers, and initiators, allowing for high thermal conductivity and mechanical properties, curable at room temperature without volatile monomers like methyl methacrylate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditionally used curable compositions (silicone-based, silane-functional polymers, polyurethane polymers) are employed to achieve high thermal conductivity, then thermal conductivity is improved, but the compositions lack adequate mechanical properties and structural fixation capability
Solution Approach 1:
The patent employs a composite material system combining (meth)acrylate monomers with high thermal conductivity fillers (such as aluminum oxide, aluminum nitride, boron nitride, or diamond particles). This composite approach allows simultaneous achievement of high thermal conductivity (≥1.0 W/mK) and adequate mechanical properties through the synergistic combination of polymer matrix and filler materials, resolving the contradiction between thermal performance and mechanical strength that plagues single-material systems like silicone-based compositions.
Solution Approach 2:
The patent optimizes the filler content parameter to at least 70 wt.% in the cured composition to achieve high thermal conductivity while maintaining mechanical integrity. By carefully controlling the filler loading, particle size distribution, and filler-matrix interface, the patent transforms the mechanical properties of the composite to accommodate high filler content without sacrificing structural fixation capability, thus resolving the contradiction between thermal conductivity and mechanical strength.
2Temperature
If high filler content (at least 70 wt.-% thermally conductive filler) is used to achieve high thermal conductivity, then thermal conductivity is improved, but viscosity increases and ease of application deteriorates
Solution Approach 1:
The patent utilizes multifunctional monomers (containing two or more polymerizable groups) which enable effective cross-linking at high filler loadings. This cross-linking mechanism allows the adhesive to achieve adequate mechanical properties and structural fixation even with at least 70 wt.% filler content, while the monomer composition is optimized to control viscosity and improve ease of application despite the high filler content.
Solution Approach 2:
The patent employs fillers with specific particle size distributions, incorporating both fine and coarse particles to optimize packing efficiency and reduce agglomeration. This local optimization of filler characteristics ensures adequate flow and application properties even at high filler content, resolving the contradiction between thermal conductivity and ease of application.
3Temperature
If two-component (meth)acrylate compositions are formulated to achieve high thermal conductivity, then thermal conductivity is improved, but curing time and process complexity increase
Solution Approach 1:
The patent employs photoinitiators that enable UV-curable two-component (meth)acrylate compositions to cure rapidly under UV irradiation. This photopolymerization mechanism allows the adhesive to achieve high thermal conductivity (≥1.0 W/mK) through high filler content while maintaining a relatively simple and fast curing process, reducing the impact of composition complexity on manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thermal conductivities of at least 1.0 W/mK, providing efficient heat dissipation for batteries and electronic devices while maintaining mechanical stability.
Implementation Method 1
a particular requirement for these adhesives and sealant materials is a high heat conductivity, since batteries and electronics generate significant amounts of heat while operating that must be dissipated efficiently
Implementation Method 2
at least one monomer M comprising free-radically polymerizable groups, containing especially at least one reactive double bond
Data Source
AI summary
The invention relates to a thermally conductive two-component (meth)acrylate adhesive composition, comprising in a first component at least one monomer comprising free-radically polymerizable groups, containing especially at least one reactive double bond, at least one elastomer comprising a polyurethane (meth)acrylate and comprising in a second component at least one initiator for free-radical curing and optionally at least one plasticizer, characterized in that the total composition comprises at least 70 wt.-% of thermally conductive filler. The two-component composition can be formulated to show optimal thermal conductivity properties that are suitable for bonding of batteries, electric or electronic devices, especially in automobile assembly. These compositions are preferably cured at room temperature and formulated without volatile and odor-intensive (meth)acrylate monomers such as MMA.