Methacrylic Resin Composition for High-Temperature Adhesion
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Solution Overview
Problem
Conventional photocurable resin compositions lack sufficient heat resistance and low outgassing properties, which are essential for high-temperature applications in electronic and optical components, leading to issues like delamination, foaming, and decreased performance.
Innovation Solution
A (meth)acrylic resin composition comprising a polyfunctional (meth)acrylate and a photopolymerization initiator, where the polyfunctional (meth)acrylate accounts for 90% by mass or more, and the photopolymerization initiator is present in amounts from 0.01 to 5 parts by mass per 100 parts of the polyfunctional (meth)acrylate, ensuring a glass transition temperature of 250° C. or higher and minimal mass loss under heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional photocurable resin compositions are used, then the composition can be cured by UV or visible light, but the heat resistance is insufficient and outgassing occurs at high temperatures
Solution Approach 1:
The patent changes the chemical composition parameters by using specific polyfunctional (meth)acrylates with high glass transition temperatures (250°C or higher) and carefully controlling the photopolymerization initiator content (0.01-5 parts by mass per 100 parts of polyfunctional (meth)acrylate). This composition parameter change enables the cured product to maintain structural integrity and minimize outgassing at high temperatures up to 250°C.
Solution Approach 2:
The patent creates a composite resin system combining polyfunctional (meth)acrylate monomers/oligomers with specific photopolymerization initiators. This composite material design achieves synergistic effects where the polyfunctional (meth)acrylate provides high heat resistance through its molecular structure while the photopolymerization initiator enables UV/visible light curing, and the controlled ratio minimizes outgassing.
2Temperature
If polyimide-based adhesive is used for heat resistance, then delamination adhesion strength is superior, but curing time is long resulting in low productivity
Solution Approach 1:
The patent replaces thermal curing (heating) with photopolymerization (UV or visible light irradiation). Instead of using heat-activated curing mechanisms like polyimide adhesives that require prolonged heating, the invention employs photopolymerization initiators that activate upon light exposure, dramatically reducing curing time from hours to seconds or minutes while maintaining heat resistance through the selection of high glass transition temperature polyfunctional (meth)acrylates.
Solution Approach 2:
The patent changes the curing mechanism parameter from thermal to photopolymerization. By selecting photopolymerization initiators with appropriate absorption spectra and quantum efficiency, and controlling their content (0.01-5 parts by mass per 100 parts of polyfunctional (meth)acrylate), the system achieves rapid curing under UV or visible light while the polyfunctional (meth)acrylate composition ensures the cured product maintains glass transition temperature of 250°C or higher.
3Productivity
If components are subjected to high temperature heating treatment, then productivity and production yield increase, but delamination, foaming, cracks, and discoloration occur
Solution Approach 1:
The patent applies beforehand cushioning by designing a resin composition with inherent high heat resistance properties before the components undergo high temperature heating treatment. The polyfunctional (meth)acrylate with glass transition temperature of 250°C or higher and controlled photopolymerization initiator content (0.01-5 parts by mass per 100 parts) create a cured product that can withstand subsequent high temperature processes (such as solder reflow at 200-250°C) without delamination, foaming, cracks, or discoloration, thus cushioning against potential damage.
4Temperature
If the glass transition temperature of the cured body is increased to 250°C or higher, then heat resistance is improved, but the composition becomes more sensitive to formulation precision
Solution Approach 1:
The patent identifies and controls critical formulation parameters: using polyfunctional (meth)acrylates with specific glass transition temperatures (250°C or higher) and maintaining photopolymerization initiator content within a precise range (0.01-5 parts by mass per 100 parts of polyfunctional (meth)acrylate). This parameter control strategy achieves the target glass transition temperature while managing formulation sensitivity through defined compositional boundaries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior heat resistance and low outgassing properties, allowing the cured products to maintain adhesiveness at high temperatures and reduce outgas emission, making them suitable for high-temperature applications in electronic and optical components.
Implementation Method 1
a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow
Data Source
AI summary
Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.