Methacrylic Resin Composition for Sealed Container Stability

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Solution Overview

Problem

Conventional (meth)acrylic resin compositions face challenges in achieving both storage stability at 25°C and low temperature curability at 60 to 140°C, especially when stored in sealed containers, and similarly, electroconductive adhesives with these compositions struggle to maintain stability and curability when containing electroconductive particles.

Innovation Solution

A (meth)acrylic resin composition comprising a urethane modified oligomer, a monomer with a hydroxyl group and/or carboxylic group and a (meth)acrylic group, and an organic peroxide, along with electroconductive particles such as silver powder treated with stearic acid, which enhances storage stability and low temperature curability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a stabilizer such as a polymerization inhibitor is added to maintain storability, then storage stability is improved, but curability is lowered and the composition may not be cured

Engineering Contradiction:
Improvestorage stabilityVSAvoidcurability
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent removes harmful stabilizers (polymerization inhibitors and metal salts) from the composition entirely, relying instead on the inherent stability of the selected peroxide and monomer system to maintain storability without compromising curability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent selects specific peroxides with appropriate decomposition temperatures and monomers with controlled reactivity to achieve a balance between storage stability and curability, using parameter optimization rather than harmful additives

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a large amount of electroconductive particles such as silver powder is included to achieve electroconductivity, then electroconductive properties are improved, but gelation occurs due to metal ions affecting peroxide

Engineering Contradiction:
Improveelectroconductive propertiesVSAvoidstorage stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent uses stearic acid surface treatment on silver particles to convert the harmful interaction between metal ions and peroxide into a beneficial protective mechanism, where the stearic acid layer prevents direct contact between silver ions and peroxide while maintaining electroconductivity

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

Stearic acid acts as an intermediary substance between the silver particles and peroxide, preventing direct interaction that would cause gelation while allowing the silver particles to maintain their electroconductive function

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If the electroconductive adhesive is stored in a container having no air permeability, then storage convenience is improved, but gelation occurs due to aerobic curability being exhibited

Engineering Contradiction:
Improvestorage convenienceVSAvoidstorage stability
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent creates an inherently stable environment within the composition that resists aerobic curability, allowing sealed container storage without gelation by selecting peroxides and monomers that remain stable in the absence of oxygen exchange

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

4Temperature

If conventional (meth)acrylic resin composition is designed for thermocurability by changing curing agent type, then thermocurability is improved, but anaerobic curability remains and gelation is accelerated when stored in sealed container

Engineering Contradiction:
Improvecurability temperatureVSAvoidstorage stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent selects peroxides and monomers with specific local properties (decomposition temperatures, reactivity levels) that enable thermocurability while inherently preventing anaerobic curability, creating localized stability within the composition system

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves extended storage stability and low temperature curability, preventing gelation and ensuring reliable adhesive properties even in sealed containers, suitable for various electronic applications.

Implementation Method 1

In radical polymerization of the (meth)acrylic resin composition, it is generally possible to impart photocurability, thermocurability, and anaerobic curability by changing the type of curing agent

Methodology Applied
Scientific EffectFree radical polymerization: Photopolymerisation

Implementation Method 2

the component (D) is at least one kind of electroconductive particles selected from silver powder and silver-plated powder that are surface-treated with stearic acid

Methodology Applied
Scientific EffectSurface treatment with stearic acid: Adsorption

Implementation Method 3

component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule

Methodology Applied
Scientific EffectHydrogen bonding: Hydrogenation

Data Source

PatentUS11505692B2(Meth) acrylic resin composition and electroconductive adhesive using the same
Publication Date: 2022.11.22 THREE BOND CO LTD
  • US11505692B2 patent drawing
  • US11505692B2 patent drawing
  • US11505692B2 patent drawing

AI summary

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.