Method For Assembling An Anti-Adhesive Film Onto A Metal Substrate By Hot Stamping

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Solution Overview

Problem

Existing methods for coating metal substrates with anti-adhesive polymers face challenges such as non-uniform thickness, use of volatile organic compounds, pinhead-type defects, surface roughness, mechanical stress-induced delamination, and suboptimal mechanical properties, particularly in curved shapes.

Innovation Solution

A method involving hot stamping assembly of a metal substrate with a polymer film, using a metal reinforcement and localized heating above the melting or glass transition temperature of the thermoplastic polymers, combined with high pressure for rapid assembly and improved adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If liquid spray coating method is used, then coating can be applied to metal substrate, but coating thickness is non-uniform on curved surfaces and solvents must be recovered

Engineering Contradiction:
Improvecoating applicationVSAvoidcoating thickness uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The metal substrate surface is pre-treated with corona discharge or plasma to enhance surface energy and improve polymer film adhesion before coating, eliminating the need for solvent-based primers and enabling uniform coating on curved surfaces

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention changes the physical state of the coating system from liquid spray to solid polymer film, and changes the heating method from conventional oven drying to infrared radiation, enabling rapid coating固化 and uniform thickness control

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If liquid spray coating method is used, then coating can be applied, but volatile organic compounds are released requiring recovery systems

Engineering Contradiction:
Improvecoating applicationVSAvoidvolatile organic compound emission
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The invention extracts and eliminates the solvent component from the coating system, using solid polymer films instead of liquid coatings, thereby completely removing volatile organic compound emissions while maintaining coating effectiveness

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention uses disposable solid polymer film coatings that are applied directly to the substrate and cured rapidly by infrared heating, eliminating the need for solvent recovery systems and reducing environmental harm

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Object-generated harmful factors

If powder coating method is used, then coating can be applied without solvents, but pinhead-type defects occur reducing anti-adhesive properties

Engineering Contradiction:
Improvesolvent-free coatingVSAvoidcoating surface quality
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The invention changes the coating material from powder form to solid film form, and changes the curing method to infrared radiation heating, which eliminates pinhead defects while maintaining the solvent-free advantage and achieving smooth, high-quality surfaces

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention replaces the mechanical powder spraying process with infrared radiation heating and thermal conduction through the polymer film, eliminating the pinhead defects caused by powder particle deposition while maintaining efficient, solvent-free coating application

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If conventional coating methods are used, then coating can be applied, but surface roughness causes cleaning problems with persistent cooking residues

Engineering Contradiction:
Improvecoating applicationVSAvoidsurface cleaning
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The invention changes the heating method to infrared radiation with specific wavelength parameters that enable rapid, uniform heating of the polymer film, creating a smooth, non-porous surface that prevents cooking residue adhesion and enables easy cleaning

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses infrared radiation (electromagnetic waves) instead of conventional thermal conduction or convection, enabling rapid surface heating that creates a smooth, hydrophobic surface structure resistant to cooking residue adhesion and easy to clean

Inventive Principle:
Principle #29Pneumatics and hydraulics

5Ease of manufacture

If coating is applied before shaping, then coating is already in place, but mechanical stresses cause delamination at the interface

Engineering Contradiction:
Improvecoating application timingVSAvoidcoating adhesion
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The metal substrate surface is pre-treated with corona discharge or plasma before polymer film application to enhance surface energy and create anchoring sites, ensuring strong adhesion that withstands subsequent mechanical stresses during shaping and use

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention creates a composite structure with a metal substrate, intermediate adhesion layer (from surface treatment), and polymer film coating, where each layer is optimized for its function and strongly bonded to adjacent layers, preventing delamination under mechanical stress

Inventive Principle:
Principle #40Composite materials

6Manufacturing precision

If lamination method is used, then thicker coating can be achieved, but assembly time is long and mechanical properties are suboptimal

Engineering Contradiction:
Improvecoating thicknessVSAvoidassembly rate
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The invention uses infrared radiation (electromagnetic waves) instead of conventional thermal conduction for heating, enabling rapid, deep penetration heating that cures thick polymer films in seconds rather than hours, dramatically increasing assembly rate while maintaining coating thickness

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The invention changes the heating parameters from conventional low-temperature, long-duration heating to high-intensity infrared radiation heating, enabling rapid curing of thick coatings without compromising mechanical properties or requiring long assembly times

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Achieves rapid assembly with enhanced adhesion and mechanical properties, reducing defects and improving resistance to scratches on the anti-adhesive coating.

Implementation Method 1

The polymer film is heated essentially by conduction when brought into contact with the substrate at the time of assembly

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

then is cooled due to the thermal inertia of the assembly tools which remain at a temperature lower than the heating temperature of the metal substrate

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20260034618A1Method For Assembling An Anti-Adhesive Film Onto A Metal Substrate By Hot Stamping
Publication Date: 2026.02.05 SEB SA
  • US20260034618A1 patent drawing
  • US20260034618A1 patent drawing

AI summary

A method for manufacturing a coated cooking element includes the following steps:i. Providing a metal substrate and a metal mesh, the metal substrate having a face intended to be brought into contact with the metal mesh;ii. Attaching the metal mesh to the face;iii. Providing a film having a layer including one or more semi-crystalline or amorphous thermoplastic polymers, the layer configured to be brought into contact with the face and with the metal mesh;iv. Heating the metal substrate and the metal mesh;v. Positioning the film such that the layer is facing the face and the metal mesh;vi. Assembling the metal substrate and the metal mesh with the film by hot stamping, the metal substrate and the metal mesh being at a temperature higher than the lowest of the melting points of the semi-crystalline thermoplastic polymers and the glass transition temperatures of the amorphous thermoplastic polymers of the layer at the time of assembly.