Method for manufacturing electronic component

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Solution Overview

Problem

The existing manufacturing processes for electronic components, such as those described in Patent Literatures 1 and 2, face issues with leakage current failures due to the penetration of plating solutions into unintended locations, leading to a complex and inefficient manufacturing process.

Innovation Solution

A method involving the formation of a first electrode layer by injecting fine metal particles onto the outer surface of an electronic component body and causing them to collide at a pressure lower than atmospheric pressure, eliminating the need for a plating process and thereby reducing the risk of leakage current failures and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a plating process is used to form external electrodes, then electrical connection is achieved, but leakage current failures occur due to plating solution penetration

Engineering Contradiction:

Improveleakage current failure suppressionVSAvoidplating solution penetration

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and eliminates the plating process from the manufacturing sequence, replacing it with a screen printing process that applies conductive paste directly to the electrode pattern. This removal of the plating step eliminates the source of plating solution penetration and subsequent leakage current failures, while maintaining the essential function of forming electrical connections between internal and external electrodes.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the electrochemical plating system with a mechanical screen printing system. Instead of using electrochemical reactions that require immersion in plating solutions, the conductive paste is mechanically applied through a screen to the substrate surface, where it is then fired to form the electrode. This substitution eliminates the harmful penetration effect while achieving the same electrical connection function.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If a plating process is used to form external electrodes, then electrical connection is achieved, but the number of manufacturing steps increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrode formation function into a single screen printing step that applies conductive paste directly to create the external electrode pattern. This consolidation eliminates the need for separate plating steps, reducing manufacturing process complexity while maintaining reliable electrical connections. The conductive paste formulation is designed to provide both the electrode material and binding function in one application.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive paste serves multiple functions simultaneously: it forms the electrode pattern, provides electrical conductivity, and acts as a binder material. This multi-functional material replaces the need for separate plating layers and binding agents, simplifying the manufacturing process while ensuring reliable electrical connections between internal and external electrodes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Strength

If fine metal particles are injected at pressure lower than atmospheric pressure, then bonding strength is enhanced, but process complexity increases

Engineering Contradiction:

Improvebonding strengthVSAvoidinjection process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent utilizes the parameter of atmospheric pressure differential to drive the injection process. By maintaining the injection chamber at pressure lower than atmospheric pressure, the pressure gradient naturally drives the fine metal particles into the electrode structure without requiring complex high-pressure injection systems. This parameter change simplifies the equipment while achieving enhanced bonding strength through controlled particle infiltration.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively suppresses leakage current failures and simplifies the manufacturing process by forming external electrodes without the use of plating, enhancing the bonding strength and reducing equivalent series resistance (ESR) in electronic components like electrolytic capacitors.

Implementation Method 1

forming a first electrode layer by injecting fine metal particles to the outer surface of the electronic component body and causing the fine metal particles to collide with the outer surface at a pressure lower than atmospheric pressure

Methodology Applied

Scientific EffectAerosol deposition: Aerosol

Data Source

PatentUS20230368978A1Method for manufacturing electronic component

Publication Date: 2023.11.16 MURATA MFG CO LTD

AI summary

A method for manufacturing an electronic component that includes: preparing an electronic component body having an internal electrode, the internal electrode being exposed on an outer surface of the electronic component body; and forming a first electrode layer by injecting fine metal particles to the outer surface of the electronic component body and causing the fine metal particles to collide with the outer surface at a pressure lower than atmospheric pressure.