Metrology Intensity Mapping Across Manufacturing Systems
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Solution Overview
Problem
Current metrology systems struggle to match data from different measurement systems, particularly due to phase-related differences, which are not captured by existing frameworks like the Jones Framework, leading to inconsistencies in overlay measurements during semiconductor manufacturing.
Innovation Solution
A method and system that utilize calibration data to determine a mapped intensity metric for a reference system, allowing for the comparison of intensity metrics from various manufacturing systems by transforming measured channel intensities based on incoming and outgoing polarizations, grating-to-sensor rotations, and wavelengths, effectively mimicking the measurement process on a reference system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If data is measured on different metrology systems, then each system can perform its measurement function, but the data from different systems does not match due to system-specific characteristics
Solution Approach 1:
The patent introduces a reference system as an intermediary that mediates between different manufacturing systems. Measured data from any manufacturing system is transformed into the reference system's coordinate frame and parameter space, enabling consistent comparison and matching. The reference system acts as a universal translator that reconciles differences in illumination schemes, polarization states, and detection geometries across multiple metrology systems.
Solution Approach 2:
The patent transforms measurement data by changing parameters such as coordinate frames, polarization states, and intensity distributions to match the reference system. By applying parameter transformations based on system-specific characteristics (e.g., illumination angles, detector orientations), the patent enables accurate data matching across different metrology systems while preserving the underlying physical measurements.
2Manufacturing precision
If sophisticated fine-tuning steps are applied to optimize pattern reproduction at low k1, then manufacturing precision improves, but device complexity and process difficulty increase
Solution Approach 1:
The patent creates a virtual reference system that copies and standardizes the measurement framework across all manufacturing systems. Instead of modifying each physical metrology system individually, the patent creates a computational model (reference system) that replicates the measurement process in a standardized manner, thereby reducing the need for complex physical adjustments while maintaining measurement accuracy.
Solution Approach 2:
The reference system serves multiple functions simultaneously: it acts as a common coordinate frame for all manufacturing systems, a standardization layer for data comparison, and a transformation medium for reconciling system-specific variations. This universal reference framework eliminates the need for separate calibration and matching procedures for each system pair, thereby reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate comparison and matching of intensity metrics across different manufacturing systems, improving data consistency and reducing system-to-system matching issues by accounting for phase effects and other calibration data.
Implementation Method 1
an intensity metric for a manufacturing system is determined based on a reflectivity of a location on a substrate
Implementation Method 2
determining the mapped intensity metric comprises combining pointwise linear transforms of measured channel intensities, with individual measurement channels characterized by an incoming-outgoing polarization
Data Source
AI summary
Methods and systems for determining a mapped intensity metric are described. Determining the mapped intensity metric includes determining an intensity metric for a manufacturing system. The intensity metric is determined based on a reflectivity of a location on a substrate and a manufacturing system characteristic. Determining the mapped intensity metric also includes determining a mapped intensity metric for a reference system. The reference system has a reference system characteristic. The mapped intensity metric is determined based on the intensity metric, the manufacturing system characteristic, and the reference system characteristic, to mimic determination of the intensity metric for the manufacturing system using the reference system. In some embodiments, the reference system is virtual, and the manufacturing system is physical.