Multi-Station Metrology Layout for Faster Overlay Measurement
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Solution Overview
Problem
Conventional lithographic apparatuses face challenges in improving overlay performance due to increased alignment measurement time and variations caused by processing steps, necessitating multiple apparatuses for measuring different substrate properties, which affects production performance and economy.
Innovation Solution
A unified alignment measuring apparatus with multiple stations and sensors to measure a large number of alignment marks, including a first station with a first alignment sensor and level sensor, and a second station with a second alignment sensor and level sensor, allowing simultaneous processing of substrates and optimizing measurement strategies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If measurement of more alignment marks is performed to improve overlay performance, then manufacturing precision is improved, but alignment measurement time increases and productivity deteriorates
Solution Approach 1:
The patent divides the alignment measurement process into two distinct stages: a first alignment measurement performed before substrate processing to establish reference positions, and a second alignment measurement performed after processing to measure actual positions. This segmentation allows the measurement system to focus on critical measurements at each stage rather than requiring exhaustive measurement of all alignment marks, thereby maintaining overlay performance while reducing total measurement time and improving productivity.
2Adaptability or versatility
If multiple processing steps are applied to substrates to manufacture devices, then product functionality is improved, but substrate variation increases and manufacturing precision deteriorates
Solution Approach 1:
The patent performs the first alignment measurement of alignment mark positions before the substrate undergoes multiple processing steps. This preliminary measurement establishes reference positions that are used to compensate for variations introduced during subsequent processing. By capturing the substrate's initial state before processing-induced variations occur, the system can correct for these variations and maintain manufacturing precision despite the complexity of multiple processing steps.
Data Source
AI summary
In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.