Metrology Sensor Arrays for High-Throughput Lithography Error Detection
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Solution Overview
Problem
Current metrology techniques for detecting and quantifying manufacturing inaccuracies in lithographic processes are low throughput, require complex and expensive tooling, and are susceptible to inherent noise and errors from imaging and detection components, limiting the frequency and precision of process control and monitoring in semiconductor manufacturing.
Innovation Solution
A method and system that utilizes an array of metrology sensors on a substrate, which produce discrete physical events sensitive to lithographic inaccuracies, allowing for direct detection and quantification of edge placement errors through imaging, independent of traditional metrology techniques, by encoding metrology data in a stable physical bitmap format that can be read at a lower spatial resolution than the errors themselves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional metrology techniques are used to detect manufacturing inaccuracies, then measurement precision can be achieved, but throughput is low and device complexity is high
Solution Approach 1:
The invention divides the substrate into multiple regions, each containing an array of sensors that independently detect manufacturing inaccuracies. This segmentation allows parallel processing of measurements across different regions, significantly increasing throughput while maintaining detection precision through distributed sensing networks.
Solution Approach 2:
The invention replaces complex mechanical metrology systems with a field-based detection approach using sensors that respond to physical fields (thermal, electrical, mechanical) generated by manufacturing processes. This substitution eliminates mechanical complexity and enables high-speed electronic readout, achieving both high throughput and precision without traditional mechanical limitations.
2Measurement precision
If traditional metrology tooling is used, then detection capability is achieved, but cost and device complexity increase
Solution Approach 1:
The invention makes the substrate itself serve as the measurement platform by integrating sensors directly into the substrate structure. This self-service approach eliminates the need for separate, complex external metrology tooling, reducing device complexity while maintaining detection capability through the substrate's own embedded sensing elements.
Solution Approach 2:
The invention designs sensors with multi-functionality, allowing the same sensor array to detect various types of manufacturing inaccuracies (thermal distortions, mechanical deformations, dimensional variations) across different process stages. This universal detection capability replaces multiple specialized tools, reducing overall system complexity and cost.
3Measurement precision
If imaging-based detection is used, then manufacturing inaccuracies can be detected, but the system becomes susceptible to imaging noise and errors
Solution Approach 1:
The invention replaces imaging-based detection with direct physical field sensing, where sensors measure manufacturing inaccuracies through their immediate physical effects (thermal expansion, electrical resistance changes, mechanical strain) rather than through optical imaging. This substitution eliminates susceptibility to imaging noise, illumination variations, and optical system errors, significantly improving reliability and reducing error susceptibility.
Data Source
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Figure 2A~2C
Figure 2D~4A
AI summary
The disclosure relates to a method for detecting and/or quantifying manufacturing inaccuracies made by a lithographic process. The method comprises: providing at least one design for fabrication of structures on a substrate using a set of lithographic processes, wherein the fabricated structures define an array of metrology sensors, wherein each metrology sensor is adapted to produce one of a known and finite set of possible distinct physical events upon application of a physical process, wherein the produced physical event: is unknown before the application of the physical process, is dependent on manufacturing inaccuracies generated by at least one of the set of lithographic processes, and is a displaced state of the fabricated structure, or has one or more physical entities associated with the fabricated structures present that were absent before the application of the physical process; applying the set of lithographical processes; applying the physical process; and reading out the produced physical events of all metrology sensors. The disclosure further relates to a metrology system.