Mezzanine Connector Caps for Reflow Alignment on Dissimilar Boards
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Solution Overview
Problem
The existing mezzanine connectors experience significant mounting position deviation due to differences in thermal expansion coefficients between the materials of the circuit boards on which the socket and plug type connectors are mounted, leading to errors during the reflow mounting process.
Innovation Solution
A connector set is designed with a first cap for the socket type connector and a second cap for the plug type connector, where the second cap is made of a material with a smaller thermal expansion coefficient than the first cap, allowing for precise alignment and reducing mounting position errors to less than 0.15 mm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same cap material is used for both socket type and plug type connectors, then the manufacturing process is simplified, but mounting position deviation increases due to thermal expansion coefficient differences between circuit boards
Solution Approach 1:
The patent applies different materials with different thermal expansion coefficients to different caps based on their specific mounting environments. The first cap (for socket type connector) uses a material with a first thermal expansion coefficient, while the second cap (for plug type connector) uses a material with a second thermal expansion coefficient. This local differentiation allows each cap to compensate for the thermal expansion characteristics of its respective circuit board, thereby reducing mounting position deviation without complicating the overall manufacturing process.
Solution Approach 2:
The patent changes the material parameter (thermal expansion coefficient) of the cap materials to match the thermal characteristics of the underlying circuit boards. By selecting cap materials with thermal expansion coefficients that correspond to their respective circuit boards, the patent optimizes the thermal-mechanical compatibility and minimizes mounting position errors that occur during reflow soldering processes.
2Manufacturing precision
If different materials are used for the first cap and second cap to reduce mounting position error, then mounting precision improves, but device complexity increases
Solution Approach 1:
The patent implements local quality by tailoring the material properties of each cap to its specific application context. The first cap is designed with material properties suited for the socket type connector's circuit board, while the second cap uses material properties optimized for the plug type connector's circuit board. This targeted approach achieves high mounting precision without requiring all components throughout the device to be differentiated, thus limiting the increase in overall device complexity.
3Productivity
If caps are not used during reflow mounting, then the manufacturing process is simpler, but mounting position deviation becomes uncontrolled
Solution Approach 1:
The patent employs preliminary action by providing caps that are pre-designed with appropriate thermal expansion coefficients before the reflow mounting process. These caps are attached to the connectors prior to reflow, establishing a protective and compensatory structure that maintains mounting position accuracy throughout the heating and cooling cycles. The caps perform their compensatory function during the critical reflow process, ensuring precision is maintained without requiring complex real-time adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively absorbs the difference in thermal expansion coefficients between the two types of connectors, minimizing mounting position errors and ensuring accurate electrical connections during high-speed signal transmission.
Implementation Method 1
when the difference between the thermal expansion coefficient of the material of the circuit board on which the socket type connector is mounted, and the thermal expansion coefficient of the material of the circuit board on which the plug type connector is mounted is large, mounting position deviation of the socket type connector and the plug type connector becomes larger after reflow
Data Source
AI summary
A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.