Mg-Cu Alloy Supersaturated Solid Solution for Thin Component Bending
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Solution Overview
Problem
There is a demand for a copper alloy for electronic and electrical devices that can maintain excellent mechanical properties while being worked into thinner plate thicknesses or smaller wire diameters, as existing alloys face issues with defects and reduced bendability due to coarse inclusions and the reactivity of Mg, leading to cracking and manufacturing yield decreases.
Innovation Solution
A copper alloy with Mg content between 1.3% and 2.8% mass, along with controlled impurity levels of H, O, S, and C, is developed to suppress the formation of coarse intermetallic compounds, ensuring a supersaturated solid solution that improves strength and bendability, and includes additional elements like Sn, Zn, Al, and Ni to enhance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If precipitation hardening is used to improve strength and proof strength, then strength is improved, but bendability significantly degrades
Solution Approach 1:
The invention changes the chemical composition parameters by strictly controlling impurity elements (H≤10ppm, O≤100ppm, S≤50ppm, C≤10ppm) and Mg content (1.3-2.8mass%), which prevents coarse intermetallic compound formation while enabling supersaturated solid solution formation through heat treatment, thereby achieving both high strength and excellent bendability
Solution Approach 2:
The invention utilizes phase transition by forming a supersaturated solid solution through solution treatment followed by quenching, which suppresses intermetallic compound precipitation and maintains a homogeneous single-phase structure that provides both high strength and superior bendability
2Strength
If Mg content is increased to improve strength, then strength is improved, but coarse intermetallic compounds are precipitated causing cracking during bending
Solution Approach 1:
The invention optimizes Mg content to 1.3-2.8mass% and strictly controls impurity elements (H≤10ppm, O≤100ppm, S≤50ppm, C≤10ppm) to prevent coarse intermetallic compound formation while maintaining high strength, achieving both strength improvement and cracking resistance
Solution Approach 2:
The invention creates a controlled environment by minimizing reactive impurities (H, O, S, C) that would form coarse intermetallic compounds with Mg, effectively creating an inert chemical environment that prevents harmful phase formation while allowing Mg to strengthen the alloy through solid solution strengthening
3Length of moving object
If component thickness is reduced to meet size reduction demands, then device size is reduced, but manufacturing yield decreases due to defects and cracking
Solution Approach 1:
The invention changes the material composition parameters to eliminate coarse inclusions and intermetallic compounds through strict impurity control and optimized Mg content, creating a homogeneous supersaturated solid solution that enables defect-free plastic working of thin components with high manufacturing yield
Solution Approach 2:
The invention achieves complete homogeneity by forming a supersaturated solid solution through solution treatment and quenching, which eliminates coarse intermetallic compounds and creates a uniform single-phase structure that prevents cracking and defects during plastic working of thin components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy achieves high 0.2% yield strength, improved conductivity, and excellent bendability, allowing for the formation of complex-shaped components without cracking, thereby enhancing manufacturing reliability and yield.
Implementation Method 1
a copper alloy which is used for components for electronic and electrical devices such as a terminal such as a connector, a relay, and a lead frame desirably has a high proof strength
Implementation Method 2
in a case in which the content of Mg is 1.3% by mass or higher (3.3% by atom or higher), an intermetallic compound made up of Cu and Mg can be precipitated by performing a solution treatment and a precipitation treatment
Data Source
AI summary
The present invention provides a copper alloy for electronic and electronic device which has excellent mechanical properties and is capable of suppressing generation of defects even in a case in which the copper alloy is worked to a thin plate thickness or a smaller wire diameter than in the related art, a plastically-worked copper alloy material, and a component and a terminal for electronic and electronic device. The copper alloy for electronic and electronic device of the present invention includes Mg in a range of 1.3 mass % to 2.8 mass % with a remainder substantially being Cu and inevitable impurities, in which a content of H is set to 10 mass ppm or lower, a content of O is set to 100 mass ppm or lower, a content of S is set to 50 mass ppm or lower, and a content of C is set to 10 mass ppm or lower.