Multi-layered Ceramic Component Mg-rich Side Gap Moisture Resistance

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Solution Overview

Problem

Multi-layered ceramic electronic components face challenges in achieving reliable moisture resistance due to level differences between ceramic layers and internal electrodes, leading to structural defects and poor moisture resistance, despite existing methods that attempt to address these issues.

Innovation Solution

A multi-layered ceramic electronic component with Mg-rich regions in side and end gap portions, where the Mg concentration is higher than in the effective layer portion, forming an oxidized compound with Ni to fill clearance and enhance bonding between internal electrodes and ceramic layers, thereby improving moisture resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of ceramic layers is reduced to downsize the chip, then the chip size is reduced, but structural defects such as delamination occur due to level differences between internal electrodes and ceramic layers

Engineering Contradiction:
Improvechip sizeVSAvoidstructural integrity
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by creating Mg-rich regions specifically in the side gap portions where level differences occur, rather than uniformly distributing Mg throughout the entire ceramic body. This localized approach addresses the delamination problem at critical interfaces while maintaining the overall chip downsizing benefit.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the chemical composition parameter by adding Mg to the ceramic paste, which modifies the sintering behavior and shrinkage characteristics of the ceramic material, enabling better matching with internal electrode shrinkage and eliminating level differences that cause delamination.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If ceramic paste is applied to offset level differences, then delamination is prevented, but minute gaps are formed between internal electrodes and ceramic layers during firing due to shrinkage behavior differences

Engineering Contradiction:
Improvebonding integrityVSAvoidmoisture penetration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the ceramic paste composition by adding Mg, which changes the shrinkage behavior during sintering to match that of the internal electrodes, thereby preventing gap formation while maintaining bonding integrity and blocking moisture penetration pathways.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure by incorporating Mg into the ceramic paste formulation, resulting in a multi-phase ceramic material that combines the benefits of level difference offsetting with matched shrinkage characteristics to prevent gap formation and moisture ingress.

Inventive Principle:
Principle #40Composite materials

3Object-affected harmful factors

If SiO2 is added to ceramic paste to reduce shrinkage difference, then moisture resistance is improved, but sintering temperature is reduced causing excessive sintering and structural defects

Engineering Contradiction:
Improvemoisture resistanceVSAvoidsintering control
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent substitutes Mg for SiO2 as the additive in ceramic paste, which achieves the desired shrinkage matching and moisture resistance improvement without the unwanted side effect of excessive sintering, thereby maintaining manufacturing precision and avoiding structural defects.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If Cu is added to ceramic paste to enhance bondability through alloying with Ni, then bonding is improved, but redox reactions occur causing volume changes and gap formation

Engineering Contradiction:
ImprovebondabilityVSAvoidcompositional stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent replaces Cu with Mg as the additive in ceramic paste, eliminating the redox reaction problem between Cu and Ni while maintaining enhanced bondability through Mg-O-Ni interfacial bonding, thereby ensuring compositional stability during firing.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach significantly enhances moisture resistance by filling interface clearances with an oxidized compound, preventing water penetration and improving the reliability of even small-sized ceramic components.

Implementation Method 1

the addition of Mg to a ceramic paste leads to formation of an oxidized compound of Mg and Ni, thereby clearing the clearance between the internal electrodes and the ceramic portions around the internal electrodes

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

a sintered ceramic body having a plurality of stacked ceramic layers

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS7859823B2Multi-layered ceramic electronic component
Publication Date: 2010.12.28 MURATA MFG CO LTD
  • US7859823B2 patent drawing
  • US7859823B2 patent drawing
  • US7859823B2 patent drawing

AI summary

In a sintered ceramic body including side gap portions arranged between sides of first and second internal electrodes and first and second side surfaces of the sintered ceramic body and between sides of the effective layer portion and the first and second side surfaces of the sintered ceramic body, regions of the side gap portions at least adjacent to the first and second internal electrodes are Mg-rich regions each having a Mg concentration greater than that of the effective layer portion.