Mg/Ti Composite Plate Bonding with Gradient Heterothermal Rolling
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Solution Overview
Problem
Existing methods for producing magnesium/titanium composite plates with large thickness ratios suffer from poor bonding stability, mechanical properties, and are not suitable for industrial-scale production due to issues like local unwelding, low intermetallic compound formation, and uncoordinated plastic deformation.
Innovation Solution
A gradient heterothermal rolling bonding method is employed, involving induction heating of the titanium strip, rolling with controlled temperature gradients, and subsequent heat treatment to achieve a stable bonding interface and coordinated plastic deformation between the magnesium alloy and titanium layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If direct rolling bonding is used to manufacture magnesium/titanium composite plate with large thickness ratios, then the manufacturing process is simple, but the bonding interface stability and mechanical properties are poor due to low intermetallic compound formation and uncoordinated plastic deformation
Solution Approach 1:
The patent applies temperature parameter changes by heating the magnesium alloy plate to 300-500℃ before rolling bonding. This temperature elevation increases atomic diffusion rate and promotes intermetallic compound formation at the bonding interface, thereby improving bonding stability and mechanical properties while maintaining the simplicity of the rolling bonding process
Solution Approach 2:
The patent performs preliminary heating of the magnesium alloy plate before the rolling bonding operation. This preliminary thermal treatment prepares the material by increasing its ductility and reducing flow stress, enabling coordinated plastic deformation between the magnesium alloy and titanium strip, which prevents interface instability and improves bonding quality
2Strength
If large rolling reduction is applied to achieve bonding, then the bonding strength increases, but the titanium strip is crushed due to uncoordinated plastic deformation between magnesium alloy plate and titanium strip
Solution Approach 1:
The patent changes the temperature parameter by heating the magnesium alloy plate to 300-500℃, which fundamentally alters the plastic deformation characteristics. At this elevated temperature, the magnesium alloy exhibits increased ductility and reduced flow stress, enabling it to deform more uniformly with the titanium strip. This allows achieving adequate bonding strength through moderate rolling reduction without crushing the titanium strip
Solution Approach 2:
The patent introduces thermal energy to dynamically change the material properties of the magnesium alloy plate during the bonding process. The temperature elevation creates a dynamic state where the magnesium alloy can accommodate the deformation requirements of the thin titanium strip, enabling coordinated plastic deformation and preventing titanium strip crushing while still achieving strong bonding
3Productivity
If explosive welding method is used, then the bonding speed is fast, but local unwelding occurs especially in the boundary zone when cladding plate is relatively thick
Solution Approach 1:
The patent changes the thermal parameter by heating the magnesium alloy plate to 300-500℃ before rolling bonding. This temperature elevation reduces the flow stress and increases the ductility of the magnesium alloy, enabling uniform deformation across the entire bonding interface including boundary zones. The result is improved bonding uniformity and elimination of local unwelding defects while maintaining efficient production through the rolling bonding process
4Reliability
If diffusion welding method is used, then the bonding interface stability is improved, but the production duration is too long for industrial large-scale production
Solution Approach 1:
The patent applies temperature parameter changes by heating the magnesium alloy plate to 300-500℃, which accelerates atomic diffusion rate by several orders of magnitude compared to room temperature. This thermal activation enables rapid intermetallic compound formation and achieves stable bonding interface within minutes rather than hours or days, making the process suitable for industrial large-scale production
Solution Approach 2:
The patent performs preliminary heating of the magnesium alloy plate before bonding, which pre-activates the atomic diffusion process. This preliminary thermal treatment creates favorable conditions for rapid intermetallic compound formation during the subsequent rolling bonding operation, achieving stable bonding interface quickly without requiring prolonged processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a magnesium/titanium composite plate with excellent bonding interface stability, mechanical properties, and uniform tissue components, suitable for high-performance applications such as aerospace without significant loss of density.
Implementation Method 1
induction heating of the titanium strip
Implementation Method 2
coordinated plastic deformation between the magnesium alloy and titanium layers
Data Source
AI summary
A magnesium/titanium composite plate with large thickness ratios and a gradient heterothermal rolling bonding method are provided by the present disclosure, relating to the technical field of rolling bonding plates. The method includes following steps: assembling blanks according to a sequence of titanium strip, transition layer foil and magnesium alloy plate to obtain a composite blank; carrying out induction heating treatment on one side of the titanium strip of the composite blank, then rolling, and carrying out heat treatment on a composite plate blank after rolling to obtain the magnesium/titanium composite plate with large thickness ratios; and a thickness ratio of the magnesium alloy plate to the titanium strip is greater than or equal to 20:1.