Laser Planar Separation of MgO Single Crystals for Thin Substrates
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Solution Overview
Problem
The increasing performance demands of semiconductor devices require more thin and lattice-defect-free magnesium oxide single crystal substrates, while existing methods are costly due to the high expense of magnesium oxide substrates used as base substrates in diamond substrate manufacturing.
Innovation Solution
A substrate manufacturing method involving the use of a condenser to irradiate a laser beam onto a magnesium oxide single crystal substrate, forming processing mark lines through relative two-dimensional movement to achieve planar separation and obtain thin, defect-free substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional crystal-growing or epitaxial methods are used to manufacture magnesium oxide single crystal substrates, then substrate quality can be maintained, but manufacturing cost becomes excessively high
Solution Approach 1:
The manufacturing process is divided into two distinct stages: first growing a large bulk single crystal (which can be reused), then using laser processing to create thin substrates. This segmentation allows the expensive crystal-growing process to be performed once for multiple substrate productions, reducing overall manufacturing cost while maintaining quality
Solution Approach 2:
A bulk single crystal is grown in advance before the actual substrate manufacturing. This preliminary bulk crystal serves as a reusable source material that can be processed multiple times into thin substrates, eliminating the need to repeatedly perform expensive crystal-growing operations for each substrate batch
2Strength
If thick magnesium oxide substrates are used as base substrates for diamond vapor-phase synthesis, then sufficient mechanical strength is provided, but substrate cost increases and reusability decreases
Solution Approach 1:
The substrate thickness parameter is optimized to the minimum required value that still provides sufficient mechanical strength for the application. By changing the thickness parameter from conventional thick values to a precisely controlled thin value, the patent reduces material consumption and cost while maintaining the necessary structural integrity for diamond vapor-phase synthesis
3Ease of repair
If conventional substrate peeling methods are used after diamond vapor-phase synthesis, then substrate reuse is achieved, but the process is complex and time-consuming
Solution Approach 1:
The conventional mechanical peeling process is replaced with laser processing. The laser creates processing mark lines that facilitate clean separation, substituting complex mechanical peeling operations with a more controlled and efficient laser-based method that reduces process complexity and time
4Manufacturing precision
If multiple processing steps are used to create thin substrates from bulk crystals, then substrate quality can be controlled, but manufacturing productivity decreases
Solution Approach 1:
The laser processing operation continues continuously to create processing mark lines across the entire bulk crystal surface. This continuous action, combined with the reusable nature of the bulk crystal, maintains high productivity while ensuring consistent quality control through uniform processing parameters applied throughout the material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient and cost-effective production of thin magnesium oxide single crystal substrates with reduced lattice defects, enabling significant cost reduction in diamond substrate manufacturing by reusing magnesium oxide substrates.
Implementation Method 1
a first step of disposing a condenser for condensing a laser beam in a non-contact manner on an irradiated surface of a single crystal member of magnesium oxide to be irradiated; a second step of irradiating a laser beam to a surface of the single crystal member and condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions using the condenser
Implementation Method 2
irradiating a laser beam to a surface of the single crystal member and condensing the laser beam into an inner portion of the single crystal member
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. A first step is performed which disposes a condenser (14) for condensing a laser beam (B) on an irradiated surface (20r) of a magnesium oxide single crystal member (20) in a non-contact manner. A second step is performed which forms processing mark lines in parallel by irradiating the laser beam (B) to the surface (20r) of the single crystal substrate (20) under designated irradiation conditions to condense the laser beam (B) into an inner portion of the single crystal substrate (20) while moving the condenser (14) and the single crystal substrate (20) relative to each other in a two-dimensional manner. A third step is performed which forms new processing mark lines between the adjacent irradiation lines in the second step to allow planar separation, by irradiating the laser beam (B) to the surface (20r) of the single crystal substrate (20) under designated irradiation conditions to condense the laser beam (B) into an inner portion of the single crystal substrate (20) while moving the condenser (14) and the single crystal substrate (20) relative to each other in a two-dimensional manner.