MgO Single-Crystal Substrate Peeling by Internal Laser Marking
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Solution Overview
Problem
The increasing demand for thin magnesium oxide single crystal substrates with fewer lattice defects poses a challenge due to the high cost and limited reusability of magnesium oxide substrates used in diamond substrate manufacturing, necessitating an efficient method for obtaining thin, high-quality substrates.
Innovation Solution
A substrate manufacturing method involving a laser condensing means that irradiates a magnesium oxide single crystal substrate with a high-power density laser beam, forming processing marks in parallel lines and causing planar peeling, allowing for the efficient production of thin substrates with reduced lattice defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a magnesium oxide substrate is peeled off and separated to obtain a thin substrate, then the substrate thickness is reduced and reusability is improved, but the substrate may develop lattice defects and the peeling process becomes complex
Solution Approach 1:
The patent applies preliminary action by forming processing marks on the substrate surface before the actual peeling process. These marks are created by irradiating the substrate with a laser beam that has been condensed by a condenser, creating predetermined locations that facilitate controlled peeling while minimizing lattice defects in the resulting thin substrate
Solution Approach 2:
The patent replaces mechanical peeling methods with a laser-based approach. Instead of using mechanical force to peel the substrate, which can cause lattice defects, the invention uses laser irradiation to create processing marks that enable controlled peeling, thereby reducing damage to the crystal lattice structure
2Ease of manufacture
If conventional peeling methods are used to obtain thin substrates, then substrate reusability is improved, but the process complexity and cost increase
Solution Approach 1:
The patent replaces complex mechanical peeling systems with a simpler laser-based system. By using laser irradiation through a condenser to create processing marks, the invention eliminates the need for complex mechanical peeling equipment while achieving the same goal of substrate reusability
Solution Approach 2:
The patent changes the parameters of the laser beam by using a condenser to condense the laser beam to a specific diameter (0.1 mm to 1.0 mm) and controlling the irradiation conditions. This parameter control allows for precise formation of processing marks that facilitate easy peeling without requiring complex additional equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the easy and cost-effective production of thin magnesium oxide single crystal substrates with reduced lattice defects, enhancing substrate reusability and contributing to cost reduction in diamond substrate manufacturing.
Implementation Method 1
irradiating a laser beam to a surface of the magnesium oxide single crystal substrate and condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions
Implementation Method 2
forming processing marks to sequentially allow planar peeling
Data Source
Figure 1A~1B
Figure 2~3
Figure 4
AI summary
A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. Performed is a first step of disposing a laser condensing means on a surface of a magnesium oxide single crystal substrate (20) of magnesium oxide to be irradiated in a non-contact manner, the laser condensing means being for condensing a laser beam. Then, a second step of causing planar peeling from a surface side of the magnesium oxide single crystal substrate (20) to be irradiated is performed. In this second step, a laser beam (B) is irradiated to the surface of the single crystal substrate (20) and the laser beam (B) is condensed into an inner portion of the single crystal substrate (20) under designated irradiation conditions. Simultaneously with the irradiation and the condensation, the laser condensing means (14) and the single crystal substrate (20) are two-dimensionally moved relatively to each other. In this way, processing mark lines (LK), each of which is composed in such a manner that processing marks (K) formed by thermal processing are formed in line at an inner portion of a single crystal member, are formed in parallel to one another. At this time, overlapped line portions (DK) in which the processing marks (K) overlap one another are formed in at least a part of the processing mark lines (LK), whereby the planar peeling is caused from the irradiated surface (20r) side .