MgO Templates via Chemical Solution Deposition

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Solution Overview

Problem

The existing methods for fabricating YBCO coated conductors require biaxially textured substrates, which are costly and complex to produce, and struggle to achieve optimal critical current density due to substrate diffusion issues and the need for thick buffer layers.

Innovation Solution

A scalable, non-vacuum chemical solution deposition method is used to create untextured barrier layers on untextured substrates, followed by the deposition of biaxially textured buffer and superconducting layers, employing materials like La2Zr2O7 and Gd2Zr2O7, and techniques such as spin-coating and dip-coating, to achieve high-quality biaxial texture without the need for expensive vacuum processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If biaxially textured substrates are used for YBCO coated conductor fabrication, then the critical current density is improved, but the manufacturing cost and process complexity increase significantly

Engineering Contradiction:
Improvecritical current densityVSAvoidsubstrate preparation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The substrate structure is segmented into multiple functional layers: untextured metal substrate, untextured barrier layer, biaxially textured buffer layer, and biaxially textured superconducting layer. This segmentation allows each layer to perform its specific function independently, with the untextured substrate providing mechanical support while the textured buffer layer provides the necessary template for epitaxial growth.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An untextured barrier layer (La2Zr2O7 or Gd2Zr2O7) is introduced as an intermediary between the untextured substrate and the biaxially textured buffer layer. This intermediary layer prevents substrate diffusion while allowing the formation of biaxial texture in the subsequent buffer layer, thereby decoupling the substrate preparation requirements from the superconducting layer requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If thick buffer layers are used to compensate for substrate diffusion, then the substrate protection is improved, but the engineering critical current density decreases

Engineering Contradiction:
Improvesubstrate diffusion barrierVSAvoidengineering critical current density
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The barrier layer thickness is optimized to a specific range (5-20 nm) that provides sufficient diffusion protection while minimizing the total buffer layer thickness. This parameter optimization ensures that the barrier layer is thin enough to allow effective biaxial texture transmission but thick enough to prevent substrate diffusion.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If vacuum deposition methods (IBAD, ISD) are used to create biaxially textured substrates, then the biaxial texture quality is improved, but the manufacturing cost and process complexity increase

Engineering Contradiction:
Improvebiaxial texture alignmentVSAvoidfabrication cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The untextured barrier layer is deposited in advance using low-cost chemical solution deposition methods before the biaxially textured buffer layer is formed. This preliminary action creates a uniform foundation that facilitates subsequent biaxial texture formation while avoiding the need for expensive vacuum-based texturing of the substrate itself.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces expensive vacuum-based deposition methods (IBAD, ISD) for substrate texturing with chemical solution deposition for barrier layer formation. The chemical solution deposition method uses solution chemistry rather than vacuum mechanics to achieve the desired layer formation, significantly reducing equipment requirements and manufacturing cost.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of high-performance YBCO coated conductors with critical current densities exceeding 300,000 A/cm2 at 75 K, while reducing the thickness and cost of buffer layers and minimizing substrate diffusion, thus improving the engineering critical current density.

Implementation Method 1

chemical solution deposition method is used to create untextured barrier layers on untextured substrates

Methodology Applied
Scientific EffectChemical solution deposition: Chemical Vapour Deposition

Implementation Method 2

techniques such as spin-coating and dip-coating

Methodology Applied
Scientific EffectSpin-coating: Spin Coating

Implementation Method 3

an untextured barrier layer of La2Zr2O7 or Gd2Zr2O7 supported by and in contact with the surface of the substrate

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 4

the top layer of which must be biaxially textured to provide a template for epitaxial YBCO growth

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS7553799B2Chemical solution deposition method of fabricating highly aligned MgO templates
Publication Date: 2009.06.30 TRIAD NATIONAL SECURITY LLC
  • US7553799B2 patent drawing
  • US7553799B2 patent drawing

AI summary

A superconducting article includes a substrate having an untextured metal surface; an untextured barrier layer of La2Zr2O7 or Gd2Zr2O7 supported by and in contact with the surface of the substrate; a biaxially textured buffer layer supported by the untextured barrier layer; and a biaxially textured superconducting layer supported by the biaxially textured buffer layer. Moreover, a method of forming a buffer layer on a metal substrate includes the steps of: providing a substrate having an untextured metal surface; coating the surface of the substrate with a barrier layer precursor; converting the precursor to an untextured barrier layer; and depositing a biaxially textured buffer layer above and supported by the untextured barrier layer.