Magneto-Hydrodynamic Cooling for Integrated Circuits

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Solution Overview

Problem

Conventional heat sinks are inadequate for efficiently cooling multiple integrated circuits on a circuit board, as they rely on convection and thermal conductivity, which can be limited by the design and materials used, and do not effectively manage heat dissipation for densely packed and high-frequency ICs.

Innovation Solution

A magneto-hydrodynamic cooling system utilizing an array of magnets to control fluid flow through pipes connected to integrated circuits, generating magnetic fields that direct and regulate the flow of thermally conductive fluid for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat sinks are used for cooling integrated circuits, then heat dissipation is achieved through convection and thermal conductivity, but cooling efficiency is insufficient for densely packed and high-frequency ICs

Engineering Contradiction:
Improvecooling efficiencyVSAvoidheat dissipation effectiveness
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent replaces the conventional passive thermal conduction system with an active magneto-hydrodynamic system. Magnetic fields are used to drive fluid flow through pipes, substituting the passive reliance on thermal conductivity and natural convection with an active magnetic field-driven fluid circulation system that actively pumps coolant through the circuit board channels

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs fluid dynamics principles by circulating a conductive fluid through pipes embedded in the circuit board. The magnetic field interacts with the electrically conductive fluid to generate Lorentz forces that drive the fluid flow, creating a hydrodynamic cooling system that efficiently transports heat away from the integrated circuits

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Reliability

If heat sinks rely on convection and thermal conductivity, then heat transfer is passive, but heat dissipation is limited by design and material constraints

Engineering Contradiction:
Improveheat transfer effectivenessVSAvoidcooling system flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic control to the cooling system by using adjustable magnetic fields to regulate fluid flow rates. The system can dynamically adapt the cooling intensity by varying the magnetic field strength, allowing the cooling performance to be adjusted based on the thermal requirements of different integrated circuits and operating conditions

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the physical state and properties of the cooling system by using electrically conductive fluids and magnetic fields. By altering parameters such as fluid conductivity, magnetic field strength, and flow rate, the system achieves superior heat transfer effectiveness compared to conventional fixed-design heat sinks

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for more efficient heat transfer and management across multiple integrated circuits, improving cooling efficiency by dynamically controlling fluid flow based on magnetic fields, thereby addressing the limitations of traditional heat sink designs.

Implementation Method 1

an array of magnets operatively disposed on the circuit board; and a plurality of pipes operatively connected between the plurality of integrated circuits and the array of magnets, where fluid flow in at least one of the plurality of pipes is dependent on at least one magnetic field generated by the array of magnets

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

pass electrically and thermally conductive fluid across the plurality of magnetic fields; and propagating the fluid using the plurality of pipes toward the plurality of integrated circuits dependent on the plurality of magnetic fields

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7417858B2Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
Publication Date: 2008.08.26 ORACLE AMERICAN INC
  • US7417858B2 patent drawing
  • US7417858B2 patent drawing
  • US7417858B2 patent drawing

AI summary

A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced across the magnetic fields. A flow of electrically conductive fluid in the plurality of pipes is dependent on and controllable by the magnetic fields and/or the electrical currents.