MHD Heat Pipe Cooling for Multi-IC Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat sink technologies are inadequate for efficiently cooling multiple integrated circuits on a circuit board, as they rely on individual heat sinks, which can be cumbersome and inefficient, and do not effectively manage heat transfer across multiple components.
Innovation Solution
A cooling apparatus utilizing a multiple magnet array to control fluid flow through magneto-hydrodynamic (MHD) pipes, which connect heat sources to a heat pipe condenser and heat sink with embedded MHD fluid pipes, enhancing heat dissipation by circulating fluid within the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat sinks are used to cool multiple integrated circuits, then cooling coverage is provided, but the system becomes cumbersome and heat transfer efficiency decreases
Solution Approach 1:
The patent combines multiple heat sink functions into a single integrated heat pipe system. The heat pipe base connects multiple heat pipes to a common condenser, allowing multiple integrated circuits to be cooled by one unified system rather than requiring separate heat sinks for each component, thereby improving heat transfer efficiency while reducing system complexity
Solution Approach 2:
The heat pipe system serves multiple functions simultaneously - it cools multiple different integrated circuits through a single system architecture. The heat pipe base and condenser structure enables one system to handle thermal management for multiple heat sources, providing universal cooling capability across different components
2Productivity
If heat sink weight is concentrated in one location, then structural support is simplified, but thermal gradients increase and cooling efficiency decreases
Solution Approach 1:
The heat pipe system segments the heat dissipation function across multiple parallel heat pipes rather than concentrating it in a single mass. Each heat pipe independently transfers heat from its evaporator section to the condenser, creating multiple thermal pathways that reduce thermal gradients and improve overall cooling efficiency
Solution Approach 2:
The patent transitions from a conventional concentrated heat sink mass to a distributed heat pipe network architecture. By organizing heat pipes in parallel and connecting them to a common condenser, the system distributes thermal management across multiple spatial dimensions, reducing thermal gradients through improved heat distribution
3Reliability
If multiple individual heat sinks are used for multiple integrated circuits, then each component is cooled, but the overall system becomes cumbersome and space-consuming
Solution Approach 1:
The patent merges multiple individual heat sink functions into a single integrated heat pipe system. The common condenser and shared heat pipe base structure allows multiple integrated circuits to be cooled by one unified system, maintaining comprehensive cooling coverage while significantly reducing structural complexity and space requirements
Solution Approach 2:
The heat pipe system provides universal cooling capability for multiple different integrated circuits through a single system architecture. The modular heat pipe design allows the same system structure to effectively cool various components with different thermal requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient cooling of multiple integrated circuits by controlling fluid flow and reducing thermal gradients, improving heat dissipation and mechanical reliability by distributing the weight of the heat sink and enhancing the cooling efficiency across the circuit board.
Implementation Method 1
evaporating the fluid from first ends of the plurality of heat pipes connected to the heat pipe base; condensing the fluid at second ends of the plurality of heat pipes connected to a heat sink
Implementation Method 2
A cooling apparatus utilizing a multiple magnet array to control fluid flow through magneto-hydrodynamic (MHD) pipes
Implementation Method 3
The increased temperature of the heat sink 50 results in an increase in the temperature of the air around the heat sink 50, whereby the heated air rises and effectively draws heat away from the integrated circuit 52. This process is referred to as 'convection.'
Data Source
AI summary
A heat source is cooled by employing heat pipes, magneto-hydrodynamic fluid pipes, and a heat sink. Heat is transmitted from evaporating ends of the heat pipes connected to the heat source to condensing ends of the heat pipes connected to the heat sink. The magneto-hydrodynamic fluid is circulated inside the magneto-hydrodynamic fluid pipes. Magnetic fields are generated using an array of magnets and an electric potential is created from a top surface to a bottom surface of each magneto-hydrodynamic fluid pipe using metal films. The magnetic fields and electric potential induce an electrically-conductive magneto-hydrodynamic fluid to circulate in the magneto-hydrodynamic fluid pipes thereby dissipating heat from the heat sink.