Magnetohydrodynamic Pump Assembly for Microelectronic Temperature Control
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Solution Overview
Problem
Existing temperature control systems for microelectronic systems suffer from electrical and electromagnetic interference, mechanical stress, and inefficient heat management, which can reduce the service life of electronic components and require significant installation space.
Innovation Solution
A magnetohydrodynamic pump with multiple modules connected in series is used to control temperature by accelerating an electrically and thermally conductive medium, reducing electrical interference and mechanical stress, and enabling efficient, uniform temperature distribution through a closed channel system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single magnetohydrodynamic pump module is used, then the device structure is simpler, but the required electrical current is higher causing more electromagnetic interference
Solution Approach 1:
The pump is divided into multiple magnetohydrodynamic modules connected in series. Each module operates at lower current while the series connection maintains the required pressure differential, thereby reducing electromagnetic interference while achieving the pumping function.
2Object-affected harmful factors
If multiple magnetohydrodynamic modules are connected in series, then electromagnetic interference is reduced, but the device complexity increases
Solution Approach 1:
The pump is divided into multiple magnetohydrodynamic modules connected in series. Each module operates at lower current while the series connection maintains the required pressure differential, thereby reducing electromagnetic interference while achieving the pumping function.
3Temperature
If conventional temperature control systems are used, then heating or cooling can be achieved, but electrical and electromagnetic interference occurs affecting component reliability
Solution Approach 1:
The patent replaces conventional electrical heating/cooling systems with a magnetohydrodynamic pump-driven fluid circulation system. The pump uses magnetic fields and electric currents to generate fluid flow for heat transfer, avoiding direct electrical contact with components and reducing electromagnetic interference, thereby improving reliability.
4Temperature
If heating current is introduced through electrodes, then heat is generated to prevent solidification, but electrical interference occurs
Solution Approach 1:
The patent replaces conventional electrical heating/cooling systems with a magnetohydrodynamic pump-driven fluid circulation system. The pump uses magnetic fields and electric currents to generate fluid flow for heat transfer, avoiding direct electrical contact with components and reducing electromagnetic interference, thereby improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient, compact, and flexible temperature control with reduced mechanical stress and electromagnetic interference, enhancing the service life of electronic components and optimizing installation space.
Implementation Method 1
an interaction of the electrically and thermally conductive medium guided in the closed channel system with the introduced electric current flow and with the generated magnetic field produces a Lorentz force, which selectively accelerates the electrically and thermally conductive medium
Implementation Method 2
the electrically and thermally conductive medium transfers heat to the at least one object to be temperature controlled during a heating process or absorbs heat from the at least one object to be temperature controlled during a cooling process
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a temperature-control assembly (1) for a microelectric system and to a microelectric system having such a temperature-control assembly (1). The temperature-control assembly (1) comprises a closed channel system (3) which comprises at least one channel (4) for guiding an electrically and thermally conductive medium (5) and is thermally coupled to at least one microelectric system object of which the temperature is to be controlled. The assembly also comprises a magnetohydrodynamic pump (7) which has a plurality of magnetohydrodynamic modules (10), each module having an electrode device with two electrodes and a magnet device that generates a magnetic field. At least two magnetohydrodynamic modules (10) are designed as pump modules (10A, 10B) and are electrically connected in series. In each of the pump modules (10A, 10B) a first electrode of the electrode device introduces an electric current flow having a predefined current density into the electrically and thermally conductive medium (5) at at least one channel portion, and a second electrode of the electrode device conducts the electric current flow out of the electrically and thermally conductive medium (5) at the at least one channel portion. This causes the electrically and thermally conductive medium (5) guided in the closed channel system (3) to interact with the introduced electric current flow and with the generated magnetic field in such a way that a Lorentz force is generated which specifically accelerates the electrically and thermally conductive medium (5) in the at least one channel portion, resulting in a pressure build-up that causes a desired volume flow of the electrically and thermally conductive medium (5) through the at least one channel (4) of the closed channel system (3). The volume flow of the electrically and thermally conductive medium (5) controls the temperature of the at least one object of which the temperature is to be controlled. The electrically and thermally conductive medium (5) transfers heat to the at least one object of which the temperature is to be controlled during a heating process or absorbs heat from the at least one object (9) of which the temperature is to be controlled during a cooling process.