Micro Analyte Electrode Microstructure for Stronger Adhesion

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing micro analyte sensors face issues with weak adhesion between the electrode's electrical conduction layer and the substrate, leading to potential detachment and reduced reliability during use.

Innovation Solution

The sensor incorporates a micro structure on the surface of the electrode's electrical conduction layer, increasing its surface area and roughness, thereby enhancing adhesion with the substrate and membrane layer, and using materials like platinum for electrodes to improve conductivity and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a smooth structure is used for the electronic conduction layer, then the manufacturing process is simple, but the adhesion between the electronic conduction layer and the substrate and membrane layer is small

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidadhesion strength

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality by creating microstructures (protrusions, depressions, or grooves) only on the surface of the electronic conduction layer where adhesion is needed, while maintaining the overall simplicity of the manufacturing process. This localized surface modification increases adhesion between the electronic conduction layer and both the substrate and membrane layer without complicating the entire manufacturing procedure.

Inventive Principle:

Principle #3Local quality

2Reliability

If platinum black is processed on the electronic conduction layer to increase adhesion, then the adhesion between the electronic conduction layer and membrane layer is improved, but the processing process becomes complicated and the cost is high

Engineering Contradiction:

Improveadhesion strengthVSAvoidprocessing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces expensive platinum black with a cost-effective microstructure design (protrusions, depressions, or grooves) that can be formed directly on the electronic conduction layer. This substitution maintains adequate adhesion strength while significantly reducing material costs and processing complexity, eliminating the need for complex platinum deposition processes.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the surface morphology parameter of the electronic conduction layer from smooth to microstructured (with protrusions, depressions, or grooves). This parameter change increases the surface area and mechanical interlocking opportunities, thereby improving adhesion without requiring expensive materials like platinum black or complex processing steps.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If platinum black is processed on the electronic conduction layer to increase adhesion, then the adhesion between the electronic conduction layer and membrane layer is improved, but the cost is high

Engineering Contradiction:

Improveadhesion strengthVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentEP4366618B1Micro analyte sensor

Publication Date: 2026.01.21 MEDTRUM TECH

Figure 1~2
Figure 3~4
Figure 5~6

AI summary

A micro analyte sensor (11) comprises a base (111) that comprises an internal part (Y) and an internal part (X). At least one electrode groups are located on the surface of the internal part (Y), and each electrode group comprises at least one working electrode (1131) and at least one additional electrode (1231, 1331). The internal part (X) is provided with a PAD (1111, 1211, 1311) corresponding to each electrode, and the PAD (1111, 1211, 1311) is electrically connected with the working electrode (1131) and the additional electrode (1231, 1331) respectively through a wire (1121, 1221, 1321). At least one surface of the electronic conduction layer of the working electrode (1131) and/or the additional electrode (1231, 1331) is provided with a micro structure (11311) to increase the surface area and roughness of the electronic conduction layer (a), enhance the adhesion force of the electrode and improve the detection reliability of the sensor.