Micro Assembler Fine Angle Control for Chiplet Orientation
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Solution Overview
Problem
Existing micro assembly technologies face challenges in achieving fine angle control for chiplets, particularly when using electrode arrays, as they struggle to orient 2-D materials like graphene with precision due to limitations in electrostatic forces and stiction issues.
Innovation Solution
A micro assembler system that employs a processor-controlled interface circuit and field generator to apply a rotation field orthogonal to electrostatic forces, using electrodes and magnetic fields to achieve precise orientation of chiplets, allowing for fine angle control of up to 0.1 degrees by selectively activating and deactivating electrodes and adjusting magnetic field angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electrostatic forces are used to position chiplets on electrodes, then chiplet positioning is achieved, but fine angle control is limited due to stiction issues
Solution Approach 1:
A dielectric fluid layer is introduced as an intermediary between the chiplet and the electrode surface. This fluid layer reduces stiction forces while enabling the application of electrostatic forces for positioning and orientation control. The fluid mediator allows chiplets to be manipulated with fine angle control (0.1 degrees) by reducing friction and enabling smooth rotation during the orientation process.
2Manufacturing precision
If electrostatic forces are used to hold chiplets, then positioning is achieved, but rotation control during orientation is difficult
Solution Approach 1:
The system applies electrostatic forces in a periodic or controlled sequence: first applying forces to bring chiplets into position, then using a rotation field to orient them, and finally applying clamping forces to secure the oriented chiplets. This periodic application of different force types enables both easy rotation during orientation and precise final positioning.
Solution Approach 2:
The dielectric fluid acts as a mediator that enables rotation control by reducing friction between the chiplet and substrate. During the orientation phase, the fluid allows chiplets to rotate freely under the influence of rotation fields, achieving precise angular positioning without the stiction problems that would otherwise hinder rotation control.
3Measurement precision
If standard electrode arrays are used, then basic positioning is achieved, but fine angle control capability is insufficient
Solution Approach 1:
The electrode array is designed to perform multiple functions: positioning chiplets, orienting them through rotation fields, and securing them in final positions. By making the electrode system multi-functional, the patent achieves fine angle control capability without requiring separate dedicated mechanisms for each operation, thereby limiting the increase in device complexity.
Solution Approach 2:
The dielectric fluid layer serves as a universal intermediary that enables all fine angle control operations. Rather than complexing the electrode array design, the fluid mediator provides the necessary low-friction environment that allows standard electrode configurations to achieve precise angular control through electric field manipulation alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and automated assembly of micro objects by allowing for the accurate orientation and positioning of chiplets, overcoming stiction and electrostatic force limitations, and facilitating the mass production of devices using 2-D materials.
Implementation Method 1
A field generator is operable to apply a rotation field that causes a rotation of the first and second chiplets on the surface
Implementation Method 2
activate the first electrode to cause an attraction force between the first electrode and the first chiplet; the first chiplet being prevented from rotating by the attraction force
Data Source
AI summary
First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.