Micro-Assembler DEP/EP Control for Dividing Micro-Object Sets
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Solution Overview
Problem
The precise placement and orientation of micro-objects on a surface is challenging due to their small size, making it difficult to form specific shapes or select them from a large pool.
Innovation Solution
A micro-assembler system using an array of phototransistors to generate dielectrophoretic (DEP) and electrophoretic (EP) forces by switching voltages on capacitors, controlled by a computing device and light patterns, allows for precise manipulation and placement of micro-objects into desired positions and orientations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to place micro-objects, then the process is simpler, but the placement precision and ability to form specific shapes deteriorates
Solution Approach 1:
The system divides the micro-assembler surface into multiple independently controllable electrode regions, allowing selective activation of specific zones to manipulate individual micro-objects or groups. This segmentation enables precise local control while maintaining overall system manageability
Solution Approach 2:
The patent replaces mechanical manipulation methods with electric field-based control. By applying voltages to electrode regions, the system generates forces that manipulate micro-objects without physical contact, achieving high precision placement while avoiding mechanical complexity
2Productivity
If manual selection and placement of micro-objects is performed, then the system is easier to operate, but the productivity and speed of assembly deteriorates
Solution Approach 1:
The system incorporates sensors that detect the positions and orientations of micro-objects on the micro-assembler. This feedback information is used by the controller to automatically adjust electrode activations, enabling the system to self-correct and achieve precise placement without manual intervention
Solution Approach 2:
The micro-assembler system performs automatic detection, decision-making, and manipulation of micro-objects. The controller autonomously determines which electrode regions to activate based on sensor feedback, eliminating the need for manual operation while maintaining high precision and speed
3Productivity
If micro-objects are densely packed to increase assembly capacity, then the productivity improves, but the measurement and detection accuracy deteriorates
Solution Approach 1:
The system applies different voltage levels and control strategies to different electrode regions based on local conditions. Each region can be independently optimized for detection or manipulation, allowing high-density packing while maintaining detection accuracy through localized control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate positioning and orientation of micro-objects into specific shapes or patterns, facilitating efficient assembly of devices.
Implementation Method 1
A micro-assembler system using an array of phototransistors to generate dielectrophoretic (DEP) and electrophoretic (EP) forces
Implementation Method 2
A micro-assembler system using an array of phototransistors to generate dielectrophoretic (DEP) and electrophoretic (EP) forces
Implementation Method 3
A micro-assembler system using an array of phototransistors to generate dielectrophoretic (DEP) and electrophoretic (EP) forces by switching voltages on capacitors, controlled by a computing device and light patterns
Data Source
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AI summary
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.