Micro Ball Coupling for Reduced Package Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional large solder balls in electronic components occupy valuable space, limiting the height and storage capacity of packages like BGA, and require additional mechanical adhesives or underfill for shock and thermal stress management, increasing complexity and cost.
Innovation Solution
The use of micro balls, specifically composite polymer-core balls with a copper and solder coating, which are smaller in diameter but provide structural support and effective thermal stress management, allowing for a smaller stand-off height and increased flexibility in package design, enabling more semiconductor die to be integrated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional large solder balls are used, then mechanical shock absorption and thermal stress management are improved, but package height increases and storage capacity is limited
Solution Approach 1:
The patent changes the size parameter of solder balls from conventional large (0.3mm diameter) to micro (0.05-0.25mm diameter), and compensates for the reduced shock absorption capability by changing the material composition to composite materials with polymer cores and metal coatings, thereby maintaining reliability while reducing height
Solution Approach 2:
The patent uses composite material structures for micro balls, specifically polymer-core balls with copper and solder coatings. The polymer core provides shock absorption, while the metal coating provides thermal conductivity and electrical connection, resolving the contradiction between small size and reliability
2Reliability
If conventional large solder balls are used, then shock and thermal stress resistance are improved, but device complexity increases due to additional adhesives or underfill
Solution Approach 1:
The patent extracts and eliminates the need for additional adhesives or underfill materials by integrating all necessary functions (mechanical bonding, shock absorption, thermal management, and electrical connection) into the micro ball structure itself, thereby simplifying the overall device design
Solution Approach 2:
The micro balls serve multiple functions simultaneously: mechanical bonding, shock absorption, thermal stress management, and electrical connection. This multi-functionality eliminates the need for separate adhesive or underfill components, reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Micro balls effectively absorb mechanical shocks and thermal stresses, reducing the package height while maintaining reliability and performance, allowing for increased storage capacity and simplified design without the need for additional adhesives or underfill.
Implementation Method 1
Micro balls effectively absorb mechanical shocks
Implementation Method 2
composite polymer-core balls with a copper and solder coating
Data Source
AI summary
A system of micro balls is disclosed for coupling an electronic component to a printed circuit board. The micro balls have a small diameter, and each contact pad may include an array of two or more micro balls. An example of a micro ball may include a polymer core, surrounded by a copper layer, which is in turn surrounded by a layer of solder.