Micro-beam Shaping Optics for IC Chip Coupling
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Solution Overview
Problem
Current optical systems face challenges in efficiently transmitting optical signals to integrated circuit (IC) chips with a small footprint and high power efficiency, particularly in transforming single-mode optical beams into focused shapes with uniform intensity distribution.
Innovation Solution
The implementation of a micro beam shaping optics (MBSO) assembly that includes a micro-mirror and an aligned fiber, where the micro-mirror transforms the beam profile from a conical shape to an elliptical or double-bulbous shape with nearly uniform intensity, using dielectric materials to minimize disturbance to surrounding electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a single-mode optical fiber is used to transmit optical signals to IC chips, then the beam can be well-controlled, but the beam footprint is too large and power efficiency is insufficient
Solution Approach 1:
The patent transforms the optical beam parameters by changing its shape from circular to elliptical/double-bulbous using a micro-mirror, thereby concentrating the light into a smaller footprint on the IC chip while maintaining high power efficiency through parameter transformation rather than direct focusing
2Area of moving object
If conventional optical focusing methods are used, then the beam can be concentrated, but the intensity distribution is non-uniform causing hot spots
Solution Approach 1:
The micro-mirror is designed with varying local slopes across its surface, where different regions have different reflection angles to redirect light uniformly across the target area, creating a double-bulbous intensity profile that eliminates hot spots while maintaining small footprint
3Strength
If metal materials are used in the optical assembly, then the structure can be strong, but electrical interference is caused to surrounding electronic devices
Solution Approach 1:
The patent employs dielectric materials (such as silicon dioxide, silicon nitride, or polymer materials) instead of traditional metal materials for the optical assembly components, creating a composite structure that maintains mechanical strength while eliminating electrical interference with surrounding electronic devices on the IC chip
4Volume of moving object
If the optical system is made compact, then the footprint is reduced, but alignment precision becomes difficult to maintain
Solution Approach 1:
The micro-mirror is integrated directly with the optical fiber array in a merged structure where the fiber array serves as both the light source and the alignment reference, eliminating the need for separate alignment mechanisms and maintaining precision while reducing overall system size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for high power efficiency and compact optical signal transmission/reception with a tightly controlled beam footprint, reducing light loss and enabling efficient communication with IC chips, while maintaining minimal electrical interference.
Implementation Method 1
The micro-mirror can be positioned and shaped to transform light transmitted between the end of the aligned fiber and a target region of an integrated circuit (IC) chip
Data Source
AI summary
An optical system can include an aligned fiber in optical communication with an optical medium. The optical system can also include a micro-mirror separated from an end of the aligned fiber by a first distance. The micro-mirror is positioned and shaped to transform light transmitted between the end of the aligned fiber and a target region of an integrated circuit (IC) chip. The micro-mirror is separated from the target region by a second distance the micro-mirror transforms an aspect ratio of a beam profile of the light.