Multi-Layer Micro Bolometer Image Sensor for Wide Spectrum Detection
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Solution Overview
Problem
Existing image sensors require multiple cameras and technologies to detect various spectral ranges, leading to mechanical, thermal, and optical distortions during manufacturing, increasing costs and reducing efficiency.
Innovation Solution
A multi-layer image sensor with a micro bolometer structure and transistor layer is developed, allowing for the detection of ultraviolet, visible, and infrared rays within a single pixel, using a semiconductor device with stacked light receiving layers and a method of forming a multi-layer light receiving structure on a single substrate to minimize light losses and enhance photoelectric conversion efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple image sensors or cameras are used to detect various spectral ranges, then the detection capability for different wavelengths is improved, but mechanical/thermal/optical distortion is generated and manufacturing complexity increases
Solution Approach 1:
The patent combines multiple light receiving layers with different spectral detection capabilities (visible light, near-infrared, short-wavelength infrared, and long-wavelength infrared layers) into a single integrated image sensor device. This merging approach enables the detection of multiple spectral ranges simultaneously while eliminating the need for multiple separate cameras, thereby resolving the technical contradiction between enhanced spectral adaptability and reduced manufacturing complexity.
Solution Approach 2:
The patent creates a universal image sensor that can detect multiple types of radiation (visible light, near-infrared, short-wavelength infrared, and long-wavelength infrared) through a single device. The multi-layer structure allows each layer to perform different detection functions, making the sensor multi-functional and capable of handling various spectral ranges without requiring separate specialized devices.
2Adaptability or versatility
If multiple image sensors or cameras are used to detect various spectral ranges, then the detection capability for different wavelengths is improved, but mechanical/thermal/optical distortion occurs due to environmental factors
Solution Approach 1:
By merging all light receiving layers into a single integrated sensor device, the patent eliminates the relative movements and alignment issues that occur between multiple separate cameras. The unified structure ensures that all spectral detections are captured simultaneously from the same optical perspective, preventing mechanical/thermal/optical distortion and improving measurement reliability.
Solution Approach 2:
The patent employs a non-destructive readout method that periodically resets and reads signals from each light receiving layer in sequence. This periodic reading approach allows for stable signal acquisition while maintaining the integrity of the captured data across different spectral layers, further enhancing measurement reliability.
3Adaptability or versatility
If multiple image sensors or cameras are used to detect various spectral ranges, then more spectral information is obtained, but cost increases due to additional electrical/mechanical/optical compensation systems
Solution Approach 1:
The patent consolidates multiple spectral detection functions into a single image sensor device, eliminating the need for multiple separate cameras and their associated compensation systems. This merging approach significantly reduces manufacturing costs by requiring only one set of electrical, mechanical, and optical components while still providing comprehensive spectral information coverage across visible light, near-infrared, short-wavelength infrared, and long-wavelength infrared ranges.
4Ease of manufacture
If a single image sensor is used to detect multiple spectral ranges, then manufacturing cost is reduced, but photoelectric conversion efficiency decreases due to light losses
Solution Approach 1:
The patent divides the single image sensor into multiple specialized light receiving layers, each optimized for detecting specific spectral ranges. This segmentation allows each layer to efficiently convert its target wavelength range into electrical signals with high photoelectric conversion efficiency, minimizing light losses while maintaining cost-effectiveness through the use of a single integrated device.
Solution Approach 2:
Each light receiving layer is designed with specific material compositions and structural characteristics optimized for its designated spectral range. For example, the visible light layer, near-infrared layer, short-wavelength infrared layer, and long-wavelength infrared layer each have tailored properties that maximize their respective photoelectric conversion efficiencies, ensuring minimal light loss across all spectral detections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the detection of multiple spectral ranges without mechanical/thermal/optical distortion, reducing costs and enhancing sensitivity and response characteristics by using a single semiconductor device with a multi-layer micro bolometer structure and transistor layer.
Implementation Method 1
a first detector including an absorber for absorbing light and converting the light into heat
Implementation Method 2
a resistor whose resistance varies according to a change in temperature of the absorber
Implementation Method 3
a multi-layer micro bolometer structure including a multi-layer micro bolometer
Data Source
AI summary
An image sensor for detecting a wide spectrum includes a plurality of infrared ray receiving layers which individually receive infrared rays having different wavelengths for each pixel, the plurality of infrared ray receiving layers stacked to each other. The image sensor, which is an integrated image sensor where at least two micro bolometers are stacked, acquires spectrum information about visible rays and near-infrared rays as well as two or more infrared rays applied on an object, without mechanical/thermal/optical distortion, and provides the spectrum information to a silicon-based semiconductor such as a photodiode, thereby improving photoelectric conversion efficiency.