Micro-bolometer Switching Circuit for Dynamic Signal Adjustment
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Solution Overview
Problem
Micro-bolometers have limited flexibility in adjusting their connection mode post-packaging, which restricts their ability to match the dynamic range of the subsequent circuit, leading to inflexibility in sensing signal adjustment.
Innovation Solution
Incorporating multiple thermal sensing pixels and switching circuits on a silicon substrate, allowing for adjustable connection modes between signal transmission lines and shared connection lines, enabling series, parallel, or disconnection configurations to optimize sensing signals based on the dynamic range of the signal processing circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the micro-bolometer array is packaged with fixed connection mode, then the manufacturing process is simplified, but the flexibility to adjust sensing signals according to post-stage circuit dynamic range is lost
Solution Approach 1:
The patent introduces switching circuits that enable dynamic reconfiguration of the micro-bolometer pixel array from fixed to adjustable connection modes. The switching circuits allow the array to transition between series, parallel, and other configurations based on the dynamic range requirements of post-stage circuits, resolving the contradiction between manufacturing simplicity and adaptability.
Solution Approach 2:
The patent divides the micro-bolometer array into independently controllable pixels with individual switching circuits. Each pixel can be independently connected or disconnected through switching circuits, enabling flexible reconfiguration of the array while maintaining a standardized packaged structure, thus preserving ease of manufacture while achieving connection mode adjustability.
2Device complexity
If the connection mode between micro-bolometer pixels is fixed, then the device structure is simplified, but the ability to match different dynamic ranges of post-stage circuits is limited
Solution Approach 1:
The switching circuits serve as intermediary components between the micro-bolometer pixels and the post-stage circuits. These intermediaries enable flexible connection mode adjustments without requiring complex reconfiguration of the entire device structure, thus maintaining structural simplicity while achieving dynamic range matching capability through controlled signal routing.
3Adaptability or versatility
If multiple switching circuits are added to enable adjustable connection modes, then the flexibility and adaptability are improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the switching circuits with the micro-bolometer pixel array in a unified integrated structure. The switching circuits are fabricated alongside the pixels using the same semiconductor manufacturing process, combining multiple functions into a single device rather than adding separate components, thereby reducing overall device complexity while maintaining connection mode flexibility.
Solution Approach 2:
The patent utilizes parameter changes in the switching circuits (on/off states) to achieve different connection modes without physically reconfiguring the device. By controlling the electrical parameters of the switching circuits, the system can transition between series, parallel, or disconnected states, providing flexibility while avoiding the complexity of mechanical or physical reconfiguration mechanisms.
Data Source
AI summary
A micro-bolometer and a thermal sensing method thereof are provided. Each of switching circuits switches connection relationship between a first connection point or a second connection point of a corresponding thermal sensing pixel and different signal transmission lines and a shared connection line, so as to adjust the connection mode of the thermal sensing pixels, the first signal transmission line, the second signal transmission line and the at least one shared connection line, and thus to change a sensing signal provided by the thermal sensing pixels.