Semiconductor Micro Bump Height Measurement via Dual Optical Reflection
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Solution Overview
Problem
Current methods fail to accurately detect defects in semiconductor micro bumps due to inconsistent heights, which can be too high or too low.
Innovation Solution
A method involving a reference object and a target object on a work platform, using two light sources and image capture units to measure height differences through movement distances and angles, determining defects based on these measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional detection methods are used, then the measurement process is simple, but the measurement precision is insufficient to detect micro bump height defects
Solution Approach 1:
The patent transitions from conventional 2D imaging to 3D height measurement by introducing vertical dimension detection through focused light reflection. The system uses the vertical position of reflected light to determine micro bump height, adding a dimensional aspect that enables precise height measurement while maintaining manageable system complexity.
Solution Approach 2:
The patent introduces a reference object as an intermediary element to enable height measurement. The reference object with known height serves as a mediator between the measurement system and the micro bumps, allowing indirect height determination through comparison. This intermediary approach simplifies the measurement process while achieving high precision.
2Manufacturing precision
If no detection method is used, then the device complexity is low, but the manufacturing precision of micro bumps cannot be controlled
Solution Approach 1:
The patent implements a feedback mechanism where the measured height information of micro bumps is used to control and adjust the manufacturing process. The detection system provides feedback on height deviations, enabling real-time or post-process adjustments to improve manufacturing precision and ensure consistent micro bump heights across production batches.
Solution Approach 2:
The patent replaces complex mechanical measurement systems with an optical detection system. Instead of using mechanical probes or contact-based measurement methods, the system uses light reflection and image capture to non-contactively measure micro bump heights, reducing mechanical complexity while improving measurement capability and manufacturing precision control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately measures semiconductor micro bump heights and identifies defects by comparing the height of the target object to a reference object, ensuring consistent quality control.
Implementation Method 1
light of a first light source and light of a second light source being simultaneously reflected by the top of the reference object, a first image capture unit capturing an image of the top of the reference object through the reflected light of the first light source
Data Source
AI summary
A semiconductor micro bump height measurement method includes the following steps: capturing a top image of a reference object by a first image capture unit and a second image capture unit; capturing a top image of a target object by the first image capture unit, and sensing a first movement distance d of a work platform or a first light source and the first image capture unit; capturing a top image of the target object by the second image capture unit, and sensing the second movement distance D of the work platform or a second light source and the second image capture unit; and when d=D, the height of the target object being equal to the height of the reference object; when d>D, calculating the height of the target object as: ΔH=(d−D)×tan(θ)□H=Hs+ΔH; when d<D, calculating the height of the target object as: ΔH=(D−d)×tan(θ)□H=HsΔH.