Micro Chamber Drive Mechanism for Semiconductor Processing
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Solution Overview
Problem
Existing semiconductor wafer processing apparatuses have complex structures, require multiple drive devices, are inconvenient for replacing micro chamber components of different sizes, suffer from imperfect leakage collection, and are prone to metal pollution due to corrosive gases and high temperatures.
Innovation Solution
A semiconductor processing apparatus with a simpler structure using a single drive device to move the upper or lower working surface, featuring a micro chamber with a drawable box device and slope surfaces for fluid collection, and a column device with a threaded step-type structure for precise positioning and easy replacement of chamber plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If two drive devices are used to drive the upper and lower working surfaces respectively, then the micro chamber can be opened and closed, but the structure becomes complex
Solution Approach 1:
The patent merges the driving functions into a single drive device that can drive either the upper or lower working surface to achieve the opening and closing of the micro chamber, eliminating the need for two separate drive devices and simplifying the overall structure
2Adaptability or versatility
If the micro chamber components are designed for different sizes, then different wafer sizes can be processed, but the replacement becomes inconvenient
Solution Approach 1:
The patent segments the micro chamber into an upper chamber and a lower chamber that can be independently replaced. The lower chamber plate can be detached from the lower box device, allowing quick replacement of micro chamber components for different wafer sizes without disassembling the entire apparatus
3Ease of operation
If multiple stainless metal columns are used for relative movement, then the upper and lower working surfaces can move, but metal pollution occurs due to corrosion
Solution Approach 1:
The patent replaces the stainless metal columns with a column device consisting of a column and a sleeve, where the sleeve is made of corrosion-resistant material that is not easily corroded by high temperature and corrosive gases, thereby eliminating metal pollution while maintaining the relative movement function
4Stability of the object's composition
If the column components are welded together, then the structure is stable, but installation and disassembly become difficult
Solution Approach 1:
The patent segments the column device into a column and a sleeve that are not welded together. The sleeve can be separately installed on the column through insertion, and the upper chamber plate with the upper working surface can be installed on the upper chamber, making installation and disassembly convenient while maintaining structural stability
Data Source
AI summary
Embodiments of a semiconductor processing apparatus are disclosed. The semiconductor processing apparatus includes a micro chamber for tightly accommodating and processing a semiconductor wafer. The micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading and removing the semiconductor wafer and a closed position for tightly accommodating the semiconductor wafer. The semiconductor processing apparatus adopts a modified column device, a lower chamber portion and a balance correction device to achieve easy operation and maintenance, better prevention of chemical processing fluid leakage, and corrosion-resistant design.