Micro Inner Flow Channel Polishing With Recycled Two-Phase Abrasive Flow

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Solution Overview

Problem

Current technologies struggle to effectively polish the surface of micro complex inner flow channels, resulting in issues such as burrs, residues, surface roughness, and remelt layers, which affect the performance and safety of fluid dynamic parts, and there is a lack of products achieving optimal surface roughness Ra ≤ 0.4 μm for machined processing or Ra ≤ 1.6 μm for additive manufacturing, especially for channels with special shapes like S-, L-, U-, or O-bends.

Innovation Solution

A polishing device and method utilizing a two-phase flow polishing medium with a viscosity of < 1000 cP, flowing at a velocity > 5 m/s and reaching saturation flow rate, combined with a recycle system to ensure continuous polishing, using a sealing system and a recycle container to facilitate efficient polishing of complex micro inner flow channels with a diameter ≤ 3 mm and length-diameter ratio ≥ 50:1, achieving ultra-mirror quality Ra 0.05 μm.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If additive manufacturing technology is used to process micro inner flow channels, then complex three-dimensional structures can be integrally formed, but surface roughness increases with semi-sintered or bonded powder particles and step effects

Engineering Contradiction:
Improvecomplex micro inner flow channel structureVSAvoidsurface roughness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces traditional mechanical polishing methods with a fluid-based polishing system using two-phase flow (liquid carrier gas mixture with abrasive particles). The high-velocity fluid stream transports abrasive particles through the micro flow channel to achieve surface polishing without mechanical contact, thereby maintaining the ability to process complex geometries while improving surface quality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a pneumatic-hydraulic two-phase flow system where a liquid carrier (water or other liquids) mixes with abrasive particles and is propelled through the micro flow channel at high velocity (>5 m/s). This fluid dynamic approach enables effective polishing of complex internal geometries that would be inaccessible to mechanical polishing tools.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Manufacturing precision

If femtosecond laser processing is used, then micro inner flow channels can be processed, but adhered residue particles and surface step effects are generated

Engineering Contradiction:
Improvemicro inner flow channel processing capabilityVSAvoidadhered residue particles and surface steps
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful effect of laser-induced surface irregularities and residue particles into a beneficial polishing opportunity. By introducing abrasive particles through the laser-processed micro flow channel, the system removes the unwanted residue and smooths surface steps, transforming the harmful laser byproducts into a starting point for surface improvement.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The system discards the harmful adhered residue particles and surface steps generated by laser processing, then recovers the micro flow channel structure by polishing it with abrasive particles carried in the two-phase flow, restoring the surface to a smooth, functional state.

Inventive Principle:
Principle #34Discarding and recovering

3Manufacturing precision

If water-conduction/long-pulse laser or EDM is used, then micro inner flow channels can be processed, but remelt layers are generated on the surface

Engineering Contradiction:
Improvemicro inner flow channel processingVSAvoidremelt layer
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent treats the remelt layer generated by laser or EDM processing as material to be removed and reused. The two-phase flow polishing system abrades the remelt layer with abrasive particles, converting this harmful surface defect into a polishing opportunity that restores the surface to its base material state with improved smoothness.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

Instead of using mechanical milling or grinding to remove remelt layers, the patent substitutes a fluid-based abrasive jet system that delivers abrasive particles through the micro flow channel at high velocity, effectively removing remelt layers without the mechanical complexity and accessibility issues of traditional mechanical removal methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Manufacturing precision

If precision machining is used, then micro inner flow channels can be processed, but burrs, inflection points, sharp corners, and tool transfer steps are created

Engineering Contradiction:
Improvemicro inner flow channel dimensional accuracyVSAvoidburs, inflection points, sharp corners, tool transfer steps
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful geometric irregularities (burs, sharp corners, inflection points) left by precision machining into material to be removed by the abrasive flow. The two-phase flow system selectively removes these sharp features and tool marks, rounding corners and smoothing surfaces while preserving the overall dimensional accuracy of the micro flow channel.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the surface geometry parameters by using controlled abrasive particle impact to remove sharp corners, inflection points, and tool transfer steps. The high-velocity two-phase flow gradually modifies the surface parameters (corner radii, surface smoothness) while maintaining the fundamental dimensional accuracy established by precision machining.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves optimal surface roughness without material limitations, effectively addressing surface irregularities and ensuring high efficiency and quality polishing of complex micro inner flow channels, even with special shapes, by leveraging the synergistic effect of low viscosity and high flow velocity.

Implementation Method 1

utilizing a two-phase flow polishing medium with a viscosity of < 1000 cP, flowing at a velocity > 5 m/s and reaching saturation flow rate

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentUS20250367781A1Polishing device and polishing method
Publication Date: 2025.12.04 AECC SHANGHAI COMML AIRCRAFT ENGINE MFG CO LTD
  • US20250367781A1 patent drawing
  • US20250367781A1 patent drawing
  • US20250367781A1 patent drawing

AI summary

A polishing device and a polishing method. The polishing device includes a thrust system, a sealing system including a piston, a cylinder body matched with the piston, and the cylinder body accommodating a polishing medium for polishing; a conveying pipeline system conveys the polishing medium to one end of an inner flow channel workpiece for polishing; a recycle system including a recycle container, a recycle pipeline, a return pipeline, a driving assembly, and a control valve assembly, the control valve assembly includes a first valve, a second valve; the recycle container is connected with the workpiece through the recycle pipeline, and the sealing system is communicated with the workpiece through the return pipeline; the first valve is coordinated with the sealing system and a low-pressure environment, the second valve is located at the return pipeline, is coordinated with the recycle container and the sealing system.