Micro Channel Device Temperature Control via Fluid Circulation
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Solution Overview
Problem
Existing micro channel devices face challenges in temperature control due to the need for precise mechanical/thermal contact with Peltier devices, leading to non-uniform heat transfer, increased thermal mass, power consumption, and size, which results in inefficient and costly temperature control.
Innovation Solution
A micro channel device processing apparatus with a heating/cooling chamber that uses a fluid control system to circulate a heating/cooling fluid for uniform temperature control, minimizing thermal mass and power consumption, and featuring a temperature control system with feedback mechanisms for dynamic temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a Peltier device is used for heating and cooling the micro channel device, then temperature control capability is achieved, but the device size, power consumption, and thermal mass increase
Solution Approach 1:
The patent extracts the temperature control function from a bulky Peltier device and implements it through a fluid-based heating/cooling system integrated into the micro channel device structure. This allows temperature control capability to be maintained while significantly reducing device size and eliminating the need for large external thermal management components.
Solution Approach 2:
The patent employs a fluid-based heating and cooling system where a fluid circulates through channels in the micro channel device to transfer heat. This hydraulic approach replaces solid-state Peltier devices, reducing thermal mass and power consumption while maintaining effective temperature control through fluid flow management.
2Temperature
If a Peltier device is used for heating and cooling the micro channel device, then temperature control capability is achieved, but power consumption increases
Solution Approach 1:
The patent utilizes a fluid circulation system for thermal management, where the fluid acts as a heat transfer medium. This hydraulic approach consumes less power compared to electrical Peltier devices, as the system can leverage natural convection or low-power pumping mechanisms to achieve effective heating and cooling.
Solution Approach 2:
The patent changes the operating parameters of the heating/cooling system by using variable fluid flow rates and temperatures to achieve different thermal conditions. This allows flexible temperature control while optimizing power consumption, as the system can adjust fluid flow parameters rather than relying on high-power electrical input.
3Temperature
If a Peltier device is used for heating and cooling the micro channel device, then temperature control capability is achieved, but heat transfer uniformity deteriorates
Solution Approach 1:
The patent employs fluid circulation through distributed channels to achieve uniform heat distribution across the micro channel device. The fluid flow can be designed to cover multiple areas simultaneously, ensuring consistent temperature profiles that are difficult to achieve with point-contact Peltier devices.
Solution Approach 2:
The patent transitions from one-dimensional point contact heating/cooling (Peltier device at a single location) to two-dimensional or three-dimensional distributed thermal management through fluid channels. This dimensional expansion allows heat to be transferred uniformly across multiple regions of the device.
4Temperature
If a Peltier device is used for heating and cooling the micro channel device, then temperature control capability is achieved, but mechanical alignment precision requirements increase
Solution Approach 1:
The patent uses integrated fluid channels that are fabricated as part of the micro channel device structure itself, eliminating the need for separate Peltier device mounting and alignment. The fluid-based system can be directly formed within the device architecture, reducing mechanical alignment requirements to standard microfabrication tolerances.
Solution Approach 2:
The patent merges the thermal management function with the structural design of the micro channel device by integrating fluid channels directly into the device body. This combination eliminates the need for separate thermal control components and their associated alignment requirements, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast and precise temperature cycling with low power consumption and uniform temperature control across a wide range, reducing the overall size and cost of the micro channel device while improving temperature control efficiency.
Implementation Method 1
a fluid control system that controls a flow of a heating/cooling fluid in the chamber
Implementation Method 2
heating/cooling fluid for uniform temperature control
Implementation Method 3
temperature control system with feedback mechanisms for dynamic temperature regulation
Data Source
AI summary
A micro channel device processing apparatus includes a heating/cooling chamber configured to receive at least a sub-portion of a micro channel device and a fluid control system that controls a flow of a heating/cooling fluid in the chamber. A method includes controlling a temperature of a sample carried by a micro channel device installed in a micro channel device processing apparatus via a heating/cooling chamber of the processing apparatus. A micro channel device processing apparatus includes a heating/cooling chamber configured to receive a micro channel device carrying a sample and means for controlling a temperature of the sample in the chamber.