Micro Semiconductor Chip Curved Light Guide Element
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Solution Overview
Problem
Micro LED displays face challenges in light extraction efficiency due to the high probability of total reflection, which affects their performance compared to OLED displays.
Innovation Solution
A micro semiconductor chip design incorporating a top light guide element made of thermal curable material with a refractive index greater than 1, integrated with an epitaxial structure, and a side light guide element, optimized to reduce total reflection by refracting emitted light and enhancing light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional planar light extraction surface is used, then the device structure is simple, but the light extraction efficiency is low due to high total reflection probability
Solution Approach 1:
The patent applies curvature to the light extraction surface by forming a light guide element with a curved outer surface (spherical, hemispherical, or lens-shaped). This curved surface reduces total internal reflection at the interface between the semiconductor chip and the external environment, thereby improving light extraction efficiency. The curvature transforms the flat extraction surface into a rounded or lens-shaped surface that optimizes light emission.
Solution Approach 2:
The patent changes the refractive index parameter by introducing a light guide element made of material with a specific refractive index (1.4-1.6) that is lower than the semiconductor chip material. This refractive index mismatch creates optimal conditions for light extraction by reducing total internal reflection. The curvature radius is also optimized to be between 1-10 times the chip size to achieve optimal light extraction performance.
2Loss of energy
If a curved light extraction surface is implemented, then light extraction efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the light guide element with the semiconductor chip structure itself, forming an integrated component where the light guide element is directly formed on or as part of the chip. This integration reduces the number of separate components and assembly steps, thereby reducing manufacturing complexity while maintaining the light extraction benefits of the curved surface.
Solution Approach 2:
The light guide element serves multiple functions: it acts as both the structural component defining the curved light extraction surface and as the optical element that guides and extracts light. This multi-functionality reduces the need for additional separate optical components, simplifying the overall device structure and manufacturing process.
3Loss of energy
If the light guide element material has high refractive index, then light extraction is improved, but the material selection and processing become more difficult
Solution Approach 1:
The patent optimizes the refractive index parameter to be in the range of 1.4-1.6, which is lower than conventional high-refractive-index materials but still provides effective light extraction. This parameter optimization balances light extraction performance with material availability and ease of processing, making the invention more manufacturable while maintaining improved light extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction efficiency, leading to better performance in micro LED displays and reduces the probability of failed chip transfers during manufacturing, thereby increasing production efficiency.
Implementation Method 1
optimized to reduce total reflection by refracting emitted light and enhancing light extraction efficiency
Implementation Method 2
The top light guide element consists of a thermal curable material, wherein the thermal curable material has a thermal curing temperature from about 50° C. to 250° C.
Data Source
AI summary
A micro semiconductor chip, a micro semiconductor structure, and a transfer device are provided. The micro semiconductor chip includes an epitaxial structure, a first-type electrode, a second-type electrode and a top light guide element. The epitaxial structure has a top surface, a bottom surface and a side surface. The top light guide element is disposed on the top surface of the epitaxial structure, wherein the top light guide element has a light extraction surface and a bottom surface, wherein the edge of the light extraction surface completely overlaps the edge of the bottom surface of the top light guide element. The light extraction surface is a curved surface, a combination of at least two curved surfaces, or a combination of at least one curved surface and at least one planar surface.