Micro Chip Transfer Using Grooves and Hydrophobic Wiping
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Solution Overview
Problem
The pick and place method for transferring micro LEDs has low productivity due to the increasing size of displays and decreasing size of micro LEDs, which complicates the alignment and placement of micro semiconductor chips.
Innovation Solution
A micro semiconductor chip transfer method and device that uses a transfer substrate with grooves, a suspension of micro semiconductor chips and a liquid, and a hydrophobic wiper for alignment, allowing for efficient alignment and cleaning of chips within the grooves using a hydrophobic wiper and a hydrophilic absorbent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick and place method is used to transfer micro LEDs, then micro semiconductor chips can be placed on display devices, but productivity is low due to decreasing chip size and increasing display size
Solution Approach 1:
The micro semiconductor chips automatically align themselves into the grooves of the transfer substrate through capillary action when liquid is supplied. The chips self-organize without requiring external alignment mechanisms, enabling high-speed transfer while maintaining precision.
Solution Approach 2:
Liquid is supplied to the transfer substrate to enable capillary action, which draws the micro semiconductor chips into the grooves. This hydraulic approach replaces mechanical pick-and-place operations, significantly improving productivity while maintaining alignment precision through the physical properties of the liquid-chip interaction.
2Ease of operation
If micro semiconductor chips are aligned using traditional methods, then chips can be positioned, but the process is complex and time-consuming
Solution Approach 1:
The chips automatically align themselves into the grooves of the transfer substrate through capillary action when liquid is supplied. The chips self-organize without requiring external alignment mechanisms, enabling high-speed transfer while maintaining precision.
Solution Approach 2:
The invention changes the physical state by introducing liquid to the system, which alters the interaction between chips and substrate through capillary forces. This parameter change enables rapid, easy alignment without complex mechanical positioning systems.
3Manufacturing precision
If hydrophobic wiper is used to sweep the transfer substrate, then micro semiconductor chips are effectively aligned in grooves, but liquid and misaligned chips must be removed
Solution Approach 1:
The transfer substrate has different surface properties in different regions: grooves have hydrophilic properties to attract and hold chips with liquid, while the inter-groove regions have hydrophobic properties that repel liquid. This local quality difference enables automatic chip alignment in grooves while preventing liquid accumulation in inter-groove regions, simplifying the cleaning process.
Solution Approach 2:
The hydrophobic wiper that initially seems to create a cleaning problem by leaving liquid on the substrate actually benefits the process by pushing liquid and misaligned chips toward the drainage region. The apparent harm of remaining liquid is converted into a benefit by directing it to a controlled drainage area, simplifying overall cleanup.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method and device improve the transfer yield by effectively aligning and cleaning micro semiconductor chips, enhancing the efficiency of chip placement and reducing the complexity of handling smaller chips on larger displays.
Implementation Method 1
sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate
Implementation Method 2
cleaning the transfer substrate by removing, from the transfer substrate, the micro semiconductor chips that are not aligned inside the grooves and at least a portion of the liquid by sweeping the transfer substrate with an absorbent including a hydrophilic material
Data Source
AI summary
A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.