Micro Semiconductor Chip Transfer Using Grooved Substrate Alignment
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Solution Overview
Problem
The productivity of micro-LED display devices decreases as the size of micro-LEDs decreases and the size of display devices increases, due to limitations in existing transfer methods such as the pick-and-place method.
Innovation Solution
A method involving a first substrate with grooves, a support substrate, and a second substrate, where semiconductor chips are aligned and bonded using a fluid self-assembly method, with the support substrate being temporarily adhered and then separated, and the chips are adhered to the second substrate using pressure and fluid application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick-and-place method is used to transfer micro-LEDs, then individual chip placement is achieved, but productivity decreases as micro-LED size is reduced and display device size increases
Solution Approach 1:
The transfer process is segmented into multiple stages: first, micro-LEDs are transferred to a first substrate with grooves; second, the first substrate is bonded to a second substrate; third, the micro-LEDs are released from the first substrate to the second substrate. This segmentation allows each stage to be optimized independently, improving overall productivity while maintaining precision.
Solution Approach 2:
A first substrate with grooves is introduced as an intermediary carrier to temporarily hold and align micro-LEDs before final transfer to the second substrate. This intermediary structure enables batch processing and precise alignment without requiring direct pick-and-place operations on the final substrate, significantly improving productivity.
2Manufacturing precision
If micro-LED size is reduced to increase display resolution, then display quality improves, but transfer difficulty and time increase
Solution Approach 1:
Micro-LEDs are pre-aligned in grooves on the first substrate before final transfer to the second substrate. This preliminary alignment action allows batch processing of multiple micro-LEDs simultaneously, maintaining high precision even as chip size is reduced, while significantly improving transfer speed compared to individual pick-and-place operations.
Solution Approach 2:
Fluid pressure is applied to the second substrate to release and transfer micro-LEDs from the first substrate in batch. This pneumatic/hydraulic approach enables simultaneous transfer of multiple micro-LEDs, maintaining productivity even as chip size is reduced for higher display resolution.
3Area of stationary object
If display device size is increased to meet market demand, then production volume increases, but transfer time and complexity increase
Solution Approach 1:
The transfer process is divided into batch operations where multiple micro-LEDs are transferred simultaneously using the first substrate as a carrier, rather than individual transfers. This segmentation approach scales efficiently to large display devices, reducing total transfer time despite increased device area.
Solution Approach 2:
The method enables continuous batch transfer of micro-LEDs across large substrate areas. By maintaining continuous fluid pressure and using the grooved first substrate as a persistent carrier, the transfer process can proceed continuously across the entire display device area, minimizing idle time and total transfer duration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently transfers and bonds micro semiconductor chips onto a substrate, maintaining alignment and connectivity despite variations in chip size and groove depth, enhancing productivity and stability.
Implementation Method 1
supplying and aligning a plurality of semiconductor chips to the plurality of grooves
Implementation Method 2
supplying and aligning a plurality of semiconductor chips to the plurality of grooves
Implementation Method 3
aligning the plurality of semiconductor chips with the plurality of grooves by scanning the first substrate by using an absorbing member capable of absorbing the liquid
Implementation Method 4
applying a pressure to the second surface
Implementation Method 5
adhering a support substrate having a higher rigidity than the first substrate to the second surface of the first substrate
Data Source
AI summary
Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.