Micro Chip Transfer Substrate With Guide Rails for Precise Pixel Alignment
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Solution Overview
Problem
Existing technologies face challenges in precisely transferring micro semiconductor chips, such as micro-LEDs, to desired pixel positions in display apparatuses, leading to inefficiencies and increased omission rates during the transfer process.
Innovation Solution
A micro semiconductor chip transfer substrate with guide rails and grooves is used, where the guide rails are parallel and spaced apart, and the grooves accommodate the chips, allowing for precise alignment and transfer using a liquid absorber to guide the chips into position, reducing omission rates and simplifying the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer methods are used, then the transfer process is simpler, but the transfer precision and positioning accuracy of micro semiconductor chips deteriorate
Solution Approach 1:
The base substrate is segmented into multiple grooves that correspond to pixel positions, and guide rails are introduced as separate structural elements to define transfer paths. This segmentation allows micro semiconductor chips to be precisely positioned in specific grooves while maintaining an organized transfer structure
Solution Approach 2:
Guide rails are introduced as intermediary structures between the transfer mechanism and the base substrate. These guide rails serve as mediators that define precise transfer paths and guide micro semiconductor chips to their target positions, improving transfer precision without requiring direct complex positioning mechanisms
2Reliability
If precise transfer structures are implemented, then the omission rate of micro semiconductor chips is reduced, but the cleaning process becomes more difficult
Solution Approach 1:
The guide rails are designed as detachable or removable components that can be separated from the base substrate. This extraction capability allows the guide rails to be removed after the transfer process, enabling easy cleaning of the base substrate without having to disassemble complex integrated structures
3Productivity
If guide rails and grooves are added to the base substrate, then the alignment and transfer efficiency improve, but the device structure becomes more complex
Solution Approach 1:
The guide rails serve multiple functions: they define transfer paths, guide micro semiconductor chips to target positions, and can be removed for cleaning. The grooves serve as both positioning features and receptacles for the chips. This multi-functionality improves transfer efficiency without proportionally increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more precise and efficient transfer of micro semiconductor chips, reducing the omission rate and simplifying the cleaning process, thereby improving the manufacturing efficiency of display apparatuses.
Implementation Method 1
a liquid absorber to guide the chips into position
Data Source
AI summary
Provided is a micro semiconductor chip transfer substrate including a base substrate, guide rails provided on the base substrate extending in a direction parallel to each other and spaced apart from each other, and a plurality of grooves provided in the base substrate between the guide rails and configured to accommodate micro semiconductor chips.