Micro Coaxial Interconnect Assembly With Diffusion-Bonded Sheet Panels
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Solution Overview
Problem
Existing methods for producing coaxial interconnect assemblies are associated with high manufacturing costs and long lead times, particularly due to the use of machined stainless steel precision parts that are difficult and costly to produce.
Innovation Solution
The method involves forming thin stainless steel sheets with photo-patterned features, stacking them, and diffusion bonding them together to create a solid structure, which is then bonded with coaxial cables using conductive epoxy, enabling batch processing and automated assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If machined stainless steel precision parts are used to produce coaxial interconnect assemblies, then manufacturing precision and reliability are improved, but manufacturing cost and lead time increase significantly
Solution Approach 1:
The patent uses photo-patterned sheets as templates or copies that define the geometry of the coaxial interconnect features. These patterned sheets are diffusion bonded together to create the final assembly, eliminating the need for expensive precision machining while maintaining geometric accuracy through the photopatterning process
Solution Approach 2:
The patent replaces traditional mechanical machining processes with a combination of photopatterning and diffusion bonding. Instead of using CNC machines to mill precision features from solid steel blocks, the invention uses photochemical processes to create patterns on thin sheets that are then joined through diffusion bonding, substituting mechanical removal with chemical/thermal joining
2Manufacturing precision
If machined stainless steel precision parts are used to produce coaxial interconnect assemblies, then manufacturing precision and reliability are improved, but lead time increases
Solution Approach 1:
The patent performs photopatterning on thin sheets before assembly, creating all necessary geometric features in advance. The sheets are prepared with precise patterns through photochemical processes prior to diffusion bonding, eliminating the need for post-assembly machining and reducing overall lead time
Solution Approach 2:
The patent combines multiple manufacturing operations into a single diffusion bonding process. Multiple patterned sheets are stacked and bonded together in one step to create the complete coaxial interconnect assembly, eliminating sequential machining operations and significantly reducing lead time
3Manufacturing precision
If traditional machining methods are used, then manufacturing precision is maintained, but labor requirements and complexity increase
Solution Approach 1:
The patent uses photo-patterned sheets as templates that define the geometry of the coaxial interconnect features. These patterned sheets are diffusion bonded together to create the final assembly, eliminating the need for expensive precision machining while maintaining geometric accuracy through the photopatterning process
Solution Approach 2:
The patent changes the fundamental manufacturing parameters from mechanical machining (cuts, feeds, speeds, tool paths) to photochemical processes (exposure time, UV sensitivity, etch rates) and thermal bonding (temperature, pressure, time). This parameter transformation simplifies the manufacturing system by replacing complex mechanical control with more straightforward chemical and thermal processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces part costs, cycle times, and labor requirements, while supporting high-density RF interconnects and automated assembly, optimizing low-cost manufacturing with improved tolerance control.
Implementation Method 1
forming a first panel member by diffusion bonding a first sheet formed of a metal material to a second sheet formed of the metal material
Implementation Method 2
bonding the first panel member to the second panel member to form an assembly structure including a plurality of coaxial assemblies, wherein the bonding includes disposing a conductive epoxy or a conductive solder between the first panel member and the second panel member
Data Source
AI summary
A method of manufacturing one or more coaxial assemblies includes forming a first panel member and a second panel member by diffusion bonding sheets formed of a metal material, disposing one or more conductive elements between the first panel member and the second panel member at locations corresponding to the one or more coaxial assemblies, bonding the first panel member to the second panel member to form an assembly structure including a plurality of coaxial assemblies, and separating the one or more coaxial assemblies from the assembly structure. The bonding includes disposing a conductive epoxy, a conductive solder, or a layer formed of the conductive epoxy or the conductive solder and between the first panel member and the second panel member.