Electronic Component Mounting Device for Micro-Component Alignment
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Solution Overview
Problem
Conventional electronic component mounting methods face challenges with micro-sized components, such as bare-chip semiconductor elements, due to displacement issues during reflow soldering, leading to misalignment and potential short-circuiting, and existing solutions either lack self-alignment effects or compromise the sliding performance of XYθ driving mechanisms.
Innovation Solution
A method and device that secure one component while allowing the other to be freely moved in the XYθ direction during solder melting, utilizing a resin composition with solder powder and convective additives for self-assembly, and employing a heat-blocking mechanism to prevent heat transfer to the driving mechanism, ensuring accurate positioning and reliable connection without displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If reflow soldering is used to mount micro-sized electronic components, then the self-alignment effect can be obtained through surface tension of melted solder, but the components experience warp or gurge during heating that prevents accurate self-alignment
Solution Approach 1:
The patent applies preliminary pressurization to the electronic component before heating, using a pressurizing head to apply pressure to the rear surface of the component. This preliminary action prevents warp and gurge during the subsequent heating process, ensuring the component remains flat and capable of achieving accurate self-alignment when the solder melts.
Solution Approach 2:
The patent introduces a cushioning effect by applying pressure to the rear surface of the electronic component before heating. This beforehand cushioning counteracts the thermal expansion and deformation that would otherwise occur during heating, preventing the component from warping or gurgling and ensuring reliable soldering.
2Manufacturing precision
If pressurization and heating from the rear surface is applied to melt solder, then component displacement is prevented, but the self-alignment effect is lost requiring high-accuracy pre-alignment and continuous retention until solder solidifies
Solution Approach 1:
The patent merges the pressurizing function and heating function into a single integrated pressurizing head that performs both operations simultaneously. This combination maintains component stability through pressurization while enabling self-alignment through solder melting, eliminating the need for separate alignment and retention systems.
Solution Approach 2:
The patent enables the solder to perform self-alignment automatically through its surface tension when melted, without requiring external alignment mechanisms. The melted solder naturally flows to fill the gap between the electrode terminal and connecting terminal, achieving accurate connection through self-service rather than complex external control systems.
3Manufacturing precision
If vibration is applied to reduce frictional resistance during solder melting, then self-alignment is improved, but the XYθ driving mechanism's sliding performance deteriorates
Solution Approach 1:
The patent segments the vibration function from the driving mechanism by applying vibration directly to the electronic component or solder joint area, rather than to the entire XYθ driving mechanism. This segmentation allows vibration to improve self-alignment at the soldering location without affecting the sliding performance of the driving mechanism's bearings and rails.
Solution Approach 2:
The patent applies vibration locally to the specific area where solder melting and self-alignment occur, rather than globally to the entire mounting system. This localized vibration improves the self-alignment effect at the critical solder joint while leaving the XYθ driving mechanism's sliding surfaces unaffected and maintaining their performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise alignment and reliable soldering of micro-sized components with improved productivity and reliability, preventing displacement and short-circuiting, while maintaining the integrity of the XYθ driving mechanism.
Implementation Method 1
the two components are bonded to each other by a self-alignment effect resulting from the surface tension of the solder when the solder is melted
Implementation Method 2
melting the solder by heating the electronic component
Implementation Method 3
utilizing a resin composition with solder powder and convective additives for self-assembly
Data Source
AI summary
One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.